Chuko Flow Polyimide Adhesive Tape 'API-114C'
Excellent heat resistance! A non-silicone tape that can be removed without any adhesive residue even after heating at 260°C for 10 minutes on SUS plates.
"API-114C" is a non-silicone tape with excellent heat resistance. It has dimensional stability under high temperatures and does not use silicone-based materials. It can be removed from SUS plates without any adhesive residue even after being heated at 260°C for 10 minutes. In addition to being non-silicone, it also excels in electrical insulation and flame retardancy. 【Features】 ■ Can be removed from SUS plates without any adhesive residue even after being heated at 260°C for 10 minutes ■ Excellent dimensional stability under high temperatures ■ Does not use silicone-based materials *For more details, please refer to the PDF document or feel free to contact us.
- Company：鈴幸商事
- Price：Other
