Diamond wheel "USM" for machining hard and brittle materials *suitable for high-precision processing.
Ideal for high-speed and high-precision processing of hard and brittle materials such as glass for LCDs, quartz, and sapphire!
The diamond wheel 'USM' for processing hard and brittle materials is a porous metal bond suitable for high-speed and high-precision processing of LCD glass, quartz, sapphire, and more. It has a high abrasive grain retention capability and generates a good bond tail on the grinding surface. The bond tail effectively promotes the discharge of grinding debris, enhances coolant supply capacity, and increases the amount of abrasive penetration, leading to improved grindability. 【Features】 ■ Suitable for high-speed and high-precision processing ■ High grinding performance due to a bond matrix with ultra-fine pores at the micron level *For more details, please refer to the catalog. Feel free to contact us with any inquiries.
- Company:リード 横浜営業所
- Price:Other