SAL3481HV (Multi-Work Aligner)
A new type of aligner that is not affected by wafer material.
A new type of aligner compatible with various wafer sizes from 100 to 200 mm. It can perform alignment without being affected by wafer materials such as silicon wafers, silicon wafer BG tape (milky white), transparent, and translucent wafers. Utilizing a uniquely developed image sensor, it incorporates a motor driver and controller within the main unit. It is also possible to change the spindle diameter, shape, and material according to wafer size and material. Bernoulli spindles can also be equipped. Control method: RS232C and parallel photo I/O. It is possible to accommodate notches and orifices that are not specified in SEMI standards. Models with a Z-axis capable of wafer re-gripping operations can also be produced.
