We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Bond Tester.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

Bond Tester Product List and Ranking from 12 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

Bond Tester Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. オーヨー Osaka//Testing, Analysis and Measurement
  2. マツボー Tokyo//Trading company/Wholesale
  3. 日精 本社 Tokyo//Machine elements and parts
  4. 4 西進商事 Hyogo//Industrial Machinery
  5. 5 テクノアルファ Tokyo//Electronic Components and Semiconductors
Go to Company Ranking

Bond Tester Product ranking

Last Updated： Aggregation Period:Oct 15, 2025～Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Nodson DAGE Bond Tester (Joint Strength Testing Machine) オーヨー
  2. Internal Bond Strength Measurement Tester Z-Direction Internal Bond Tester マツボー
  3. Universal Bond Tester 4000Plus by Nordson 日精 本社
  4. 4 Multi Bond Tester 'SS-30WD' 西進商事
  5. 5 Bond tester インターテック販売 東京本社（拠点－関西営業所、熊本営業所）

Bond Tester Product List

16～26 item / All 26 items

Displayed results
Bond Tester "SS-30WD"

Bond Tester "SS-30WD"

Various high-precision strength tests can be performed with a single unit!

The "SS-30WD" is a device that enables various high-precision strength tests, such as wire pull tests and die shear tests, which are necessary for the inspection in the chip LED manufacturing process, all in one unit. Data management of measurement results and setting of measurement parameters can also be managed and configured using the included PC. Additionally, measurements can be conducted while heating as an option. We create various measurement jigs tailored to your measurement methods. We have delivered numerous devices for both LED development and mass production. 【Features】 ■ High reliability ■ Multiple product tests possible with one unit ■ Customizable measurement stage ■ Issuance of calibration certificates from JQA *For more details, please refer to the catalog or feel free to contact us.

  • LED
  • Other measurement and measuring equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Bond tester

Bond tester

We will solve your bond tester problems!!!

【Device Sales】 ■ DAGE4000 ■ DAGE5000 【Specifications】 ■ BS5KG ■ BS250R ■ CBP/TP5KG ■ WP100 ■ WP1KG ■ DS100 ■ Other Load Cells 【Regular Maintenance】 ■ Calibration of Various Load Cells 【Purchase Service】 ■ DAGE4000 ■ DAGE4000plus ■ DAGE4000HS ■ STELLAR4000

  • Other inspection equipment and devices

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Universal Bond Tester 4000 Stellar by Nordson

Universal Bond Tester 4000 Stellar by Nordson

It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!

The long-selling DAGE4000 has been newly transformed. You can also use the 4000 load cell. It is a suitable device for manual pull and shear production bond tests, and it can be configured for simple wire pull tests, as well as upgraded for ball shear, die shear, ball pull, or tweezer pull/peel tests. Please feel free to contact us when you need assistance. 【Features】 ■ By replacing the load cell, it can accommodate various joint strength tests such as pull tests and shear tests. ■ The load cell replacement can be done in under 10 seconds using a one-touch method. ■ The tool touch-up accuracy during ball shear tests can be measured with high precision of ±1μm. ■ Device calibration can be easily performed by users using standard weights and fixtures, and the repeatability of the device can also be verified using standard weights. * For more details, please download the PDF or feel free to contact us.

  • Tester

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Internal bond tester

Internal bond tester

Measurement of internal bonding strength of paper and cardboard

⚫ Microprocessor control ⚫ Control panel with full-color touchscreen and auxiliary buttons ⚫ Measurement range selection: ft.lb/sq.in, mJ/sq.in, J/m2 (statistical functions over 20) ⚫ Three measurement ranges with interchangeable pendulums ⚫ Reading resolution of 0.001 ft.lb (error less than 1%) ⚫ Steel robust frame designed to avoid energy loss during testing ⚫ CE mark ⚫ Automatic calibration function ⚫ Automatic pendulum release ⚫ Pneumatic fixation of sample holder ⚫ Interface: RS-232, USB

  • Testing Equipment and Devices

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
MFM1200L Bond Tester (Joint Strength Testing Machine)

MFM1200L Bond Tester (Joint Strength Testing Machine)

This is a bonding strength testing machine that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding.

- Adoption of proprietary patented technology VPM (Vertical Point Movement and Positioning) - Achieves multifunctionality, high performance, high precision, and high reproducibility - Ideal for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting

  • Strength Testing Equipment

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Laser Bond Tester II

Laser Bond Tester II

Standard feature for correcting to optimal measurement positions! It can be used for efficient sampling inspections and full bond inspections of medium lots.

The product is a laser bond tester capable of non-contact, non-destructive, and instantaneous measurement of gold wire bonds. It comes standard with a function to correct the measurement position to an optimal location using image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Target: Gold or copper wire bonding interfaces ■ Measurement Laser: Semiconductor laser ■ Measurement Area: 300mm (X)・300mm (Y) ■ Power Supply: Three-phase AC 200V 30A/max, requires grounding (Type D), etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Tester

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Laser Bond Tester II d

Laser Bond Tester II d

Non-contact, non-destructive, and instantaneous measurement is possible! You can specify the optimal measurement position.

This product is a manual measurement laser bond tester specifically for gold or copper wire bonds. It can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and testing all bonds in small lots. The measurement method is a laser periodic heating joint interface measurement method. The device safety standards comply with ISO 13849 / JIS B 9705. For further details, please contact us. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Gold/copper fine diameter wire specification *For more details, please refer to the PDF document or feel free to contact us.

  • Tester

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Laser Bond Tester II + Magazine Changer

Laser Bond Tester II + Magazine Changer

We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.

This product is a laser bond tester designed specifically for gold or copper wire bond magazine supply. It can be used for efficient sampling inspections and complete bond inspections of medium lots. It comes standard with a function that corrects to an optimal measurement position using image processing based on bond position information. For further details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating bonding interface measurement method ■ Measurement Targets - Gold/Copper wire bonding interface condition - Wire diameter: φ15μm to φ40μm ■ Measurement Laser: Semiconductor laser, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Tester

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Sigma, the ideal bond tester for strength testing of bonding wires.

Sigma, the ideal bond tester for strength testing of bonding wires.

Equipped with various load cells on a rotary head, there is no need for operators to replace the load cells! Ideal for quality control and condition setting of various bonding wires.

The Dutch company XYZTEC's bond tester Sigma can freely combine and mount up to six types of load cells (sensors) on its rotating head. With this single unit, it supports pull and shear tests for gold wire, pull, shear, and tweezer pull tests for aluminum wire, and pull shear tests for Al ribbon wire. There is no need for operators to change load cells (cartridges) or set range switches. This reduces work time and prevents accidents from dropping or damaging load cells. Additionally, its smooth stage operation, wide range of motion, automatic pull hook rotation function, and shear sensor's Θ rotation mechanism significantly enhance work efficiency. The utility requirement is only 100VAC (no compressed air needed). It has a proven track record of deliveries to many major semiconductor manufacturers both globally and domestically.

  • Other inspection equipment and devices

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of Bond Tester

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.