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Bond Tester Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

Bond Tester Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. オーヨー Osaka//Testing, Analysis and Measurement
  3. テクノアルファ Tokyo//Electronic Components and Semiconductors
  4. 4 アイエルテクノロジー Aichi//Testing, Analysis and Measurement
  5. 5 マツボー Tokyo//Trading company/Wholesale
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Bond Tester Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. 接合強度試験機『MFMシリーズ／ABTシリーズ』
  2. Nodson DAGE Bond Tester (Joint Strength Testing Machine) オーヨー
  3. Internal Bond Strength Measurement Tester Z-Direction Internal Bond Tester マツボー
  4. Netherlands XYZTEC Bond Tester Sigma (Joint Strength Testing Machine) テクノアルファ
  5. 4 MFM1200L Bond Tester (Joint Strength Testing Machine) オー・エル・エム インターナショナル 本社営業所

Bond Tester Product List

16～24 item / All 24 items

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Bond Tester "SS-30WD"

Bond Tester "SS-30WD"

Various high-precision strength tests can be performed with a single unit!

The "SS-30WD" is a device that enables various high-precision strength tests, such as wire pull tests and die shear tests, which are necessary for the inspection in the chip LED manufacturing process, all in one unit. Data management of measurement results and setting of measurement parameters can also be managed and configured using the included PC. Additionally, measurements can be conducted while heating as an option. We create various measurement jigs tailored to your measurement methods. We have delivered numerous devices for both LED development and mass production. 【Features】 ■ High reliability ■ Multiple product tests possible with one unit ■ Customizable measurement stage ■ Issuance of calibration certificates from JQA *For more details, please refer to the catalog or feel free to contact us.

  • LED
  • Other measurement and measuring equipment

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Internal bond tester

Internal bond tester

Measurement of internal bonding strength of paper and cardboard

⚫ Microprocessor control ⚫ Control panel with full-color touchscreen and auxiliary buttons ⚫ Measurement range selection: ft.lb/sq.in, mJ/sq.in, J/m2 (statistical functions over 20) ⚫ Three measurement ranges with interchangeable pendulums ⚫ Reading resolution of 0.001 ft.lb (error less than 1%) ⚫ Steel robust frame designed to avoid energy loss during testing ⚫ CE mark ⚫ Automatic calibration function ⚫ Automatic pendulum release ⚫ Pneumatic fixation of sample holder ⚫ Interface: RS-232, USB

  • Testing Equipment and Devices

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MFM1200L Bond Tester (Joint Strength Testing Machine)

MFM1200L Bond Tester (Joint Strength Testing Machine)

This is a bonding strength testing machine that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding.

- Adoption of proprietary patented technology VPM (Vertical Point Movement and Positioning) - Achieves multifunctionality, high performance, high precision, and high reproducibility - Ideal for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting

  • Strength Testing Equipment

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Laser Bond Tester II

Laser Bond Tester II

Standard feature for correcting to optimal measurement positions! It can be used for efficient sampling inspections and full bond inspections of medium lots.

The product is a laser bond tester capable of non-contact, non-destructive, and instantaneous measurement of gold wire bonds. It comes standard with a function to correct the measurement position to an optimal location using image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Target: Gold or copper wire bonding interfaces ■ Measurement Laser: Semiconductor laser ■ Measurement Area: 300mm (X)・300mm (Y) ■ Power Supply: Three-phase AC 200V 30A/max, requires grounding (Type D), etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Tester

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Laser Bond Tester II d

Laser Bond Tester II d

Non-contact, non-destructive, and instantaneous measurement is possible! You can specify the optimal measurement position.

This product is a manual measurement laser bond tester specifically for gold or copper wire bonds. It can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and testing all bonds in small lots. The measurement method is a laser periodic heating joint interface measurement method. The device safety standards comply with ISO 13849 / JIS B 9705. For further details, please contact us. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Gold/copper fine diameter wire specification *For more details, please refer to the PDF document or feel free to contact us.

  • Tester

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Laser Bond Tester II + Magazine Changer

Laser Bond Tester II + Magazine Changer

We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.

This product is a laser bond tester designed specifically for gold or copper wire bond magazine supply. It can be used for efficient sampling inspections and complete bond inspections of medium lots. It comes standard with a function that corrects to an optimal measurement position using image processing based on bond position information. For further details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating bonding interface measurement method ■ Measurement Targets - Gold/Copper wire bonding interface condition - Wire diameter: φ15μm to φ40μm ■ Measurement Laser: Semiconductor laser, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • Tester

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Bond tester

Bond tester

We will solve your bond tester problems!!!

【Device Sales】 ■ DAGE4000 ■ DAGE5000 【Specifications】 ■ BS5KG ■ BS250R ■ CBP/TP5KG ■ WP100 ■ WP1KG ■ DS100 ■ Other Load Cells 【Regular Maintenance】 ■ Calibration of Various Load Cells 【Purchase Service】 ■ DAGE4000 ■ DAGE4000plus ■ DAGE4000HS ■ STELLAR4000

  • Other inspection equipment and devices

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