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16～18 件を表示 ／ 全 18 件
Increase the efficiency of semiconductor manufacturing by 60% compared to conventional methods! Optimize and extend the lifespan of consumable industrial equipment.
In the post-processing of semiconductor manufacturing, we provide optimal pickup tools and more based on years of design and improvement experience. A device just for you will be born.
Even if it's not for the entire processing, orders for just specific processes like hardening or turning are also acceptable!
At Yamato Seiko Co., Ltd., we design and manufacture precision jigs and tools. In addition, we also produce various industrial machine parts (including discontinued parts for food and packaging manufacturing equipment) and offer heat treatment processing. (Requests for heat treatment processing only are also possible.) Our main and specialized areas involve chucks used in lathes, milling machines, machining centers, grinding machines, gear cutting machines, various dedicated machines, and inspection machines, where precision and durability are required. However, please feel free to consult us regarding any field. 【Strengths in Small-Batch Production (Partial)】 ■ Two-stage hardening of collets (the waist section is low hardness, while the clamping section is high hardness, with hardening applied not only to the surface but also to the center) is possible. * Two-stage hardening of collets is only available when combined with part processing and heat treatment processing. ■ We have a consistent production system in our own factory that covers all processes, including design, material procurement, turning, milling, hardening, polishing, assembly, and inspection. ■ Even if not all processes are required, orders for only certain processes, such as hardening or turning, are also acceptable. *For more details, please download the PDF or feel free to contact us.
![[Case Study] How to reduce damage to pickups?](https://image.mono.ipros.com/public/product/image/6ff/2000397984/IPROS81320635817264709750.jpeg?w=280&h=280)
Improvement of damage defects such as microcracks! Leave it to us with our pickup tools.
We would like to introduce a case of defect improvement in the transfer process of sensor chips that we proposed. In the process of transferring indium phosphide and gallium arsenide sensor chips to the inspection stage, defects due to cracks and micro-cracks were occurring. Due to the fragility of the material, the challenge was to create a pickup collet that would minimize damage. When we replaced the conventional very hard carbide collet with a rubber collet, the occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. [Case Study] ■ Issues - Defects due to cracks and micro-cracks were occurring at a rate of 50%. - A damage-minimizing pickup collet was needed due to the fragility of the material. - The transport speed of the transfer device was set to the slowest speed, but no improvement was observed. ■ Proposal - Replaced the carbide collet with a rubber collet. - The occurrence of cracks and micro-cracks was eliminated, resulting in zero defects. *For more details, please refer to the PDF document or feel free to contact us.
