Copper sulfate plating additive for wafers - TORYZA LCN series
Newly developed copper sulfate plating chemicals for wiring of semiconductor wafers.
As the functionality, performance, and miniaturization of semiconductors continue to evolve, new technologies related to three-dimensional integration of semiconductors are being developed one after another. Consequently, addressing the miniaturization of wiring (narrow pitch) and heat dissipation measures has become increasingly important. To meet various demands, our company has newly developed sulfuric acid copper plating chemicals, the TORYZA LCN series, for semiconductor wafer wiring.
- Company：奥野製薬工業 大阪・放出、東京、名古屋など
- Price：Other
