Sputtering and deposition composite device
1-inch UHV-compatible sputter cathode with 2 sources! The load lock chamber can be expanded!
This product is a film deposition device that combines RF sputtering and resistance heating evaporation. It is possible to add a load lock chamber. It features a heating and rotating substrate holder compatible with 2-inch substrates. Additionally, it has a 1-inch UHV-compatible sputter cathode with two sources and a three-source switchable resistance heating evaporation system. 【Features】 ■ 1-inch UHV-compatible sputter cathode with two sources ■ Three-source switchable resistance heating evaporation ■ Heating and rotating substrate holder compatible with 2-inch substrates ■ Load lock chamber can be added *For more details, please refer to the PDF materials or feel free to contact us.
- Company：ケニックス
- Price：Other
