1-inch UHV-compatible sputter cathode with 2 sources! The load lock chamber can be expanded!
This product is a film deposition device that combines RF sputtering and resistance heating evaporation. It is possible to add a load lock chamber. It features a heating and rotating substrate holder compatible with 2-inch substrates. Additionally, it has a 1-inch UHV-compatible sputter cathode with two sources and a three-source switchable resistance heating evaporation system. 【Features】 ■ 1-inch UHV-compatible sputter cathode with two sources ■ Three-source switchable resistance heating evaporation ■ Heating and rotating substrate holder compatible with 2-inch substrates ■ Load lock chamber can be added *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
We manufacture and sell custom-made products that satisfy our customers. We also respond to various other requests.