Fluoroscopic inspection equipment - List of Manufacturers, Suppliers, Companies and Products

X-ray fluoroscopy and CT examination device: Observation case of a microphone

[Video Available] X-ray fluoroscopy observation & orthogonal CT observation! We will introduce observation cases of microphones.

We would like to introduce a case study of observing microphone components using X-ray fluoroscopy and orthogonal X-ray CT. MEMS chips and Si chips are transparent, making them only faintly observable. However, in the X-ray fluoroscopic images, the wire bonding and the wiring patterns of the mounting substrate can be observed. In the orthogonal CT images, MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. Additionally, while the fluoroscopic images show the observation of overlapping layers, the CT images allow for observation of each layer individually. [Observation Case of Microphones] ■ X-ray Fluoroscopic Images - Wire bonding and wiring patterns of the mounting substrate can be observed. ■ Orthogonal CT Images - MEMS chips and Si chips can be observed more clearly compared to the fluoroscopic images. *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

X-ray inspection equipment
Other inspection equipment and devices

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X-ray fluoroscopy and CT examination equipment: Examples of combined use of transmission observation and image processing technology.

Detecting differences between normal product images and defective product images through image processing! Introducing a case study of the combined use of transmitted observation and image processing technology.

We will introduce a case study of the combined use of X-ray transmission observation and CT scanning equipment with image processing technology. In the transmission X-ray images of normal substrates and defective substrates, the wiring was intricately arranged, and abnormalities were not apparent at first glance. However, image processing allowed us to detect the differences between the images of normal and defective products. Identifying defective areas from a wide field of view is challenging, especially in cases of pattern abnormalities in substrate wiring. However, by using image processing software in conjunction, it becomes possible to discover abnormal areas. [Case Study of Combined Use of Transmission Observation and Image Processing Technology] ■ Detection of differences between images of normal and defective products through image processing - Upon examining the white spots in the X-ray transmission image of the defective product, a shape resembling a broken wire was confirmed. *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

X-ray inspection equipment
Other inspection equipment and devices

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X-ray fluoroscopy and CT scanner: Device appearance and main specifications

Introduction of YXLON's multi-focus Cheetah EVO! It can be used for various applications, including electronic components.

X-ray observation is a method of non-destructive testing and is the first inspection conducted for analysis and evaluation. It is effective for initial observation of various components and materials, including implemented circuit boards and electronic parts. Additionally, CT inspection allows for three-dimensional structural capture, enabling visual judgment. The "Cheetah EVO" is equipped with a reflow simulator, allowing real-time observation of phenomena such as void behavior during soldering, which can be utilized for setting reflow conditions and selecting solder. 【Device Specifications】 ■ YXLON Cheetah EVO - X-ray generator: Multi-focus transmission type - Tube voltage: 25-160kV - Tube current: 0.01-1.0mA - Tube power: 64W - Additional features: Orthogonal CT, oblique CT, reflow simulator *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

X-ray inspection equipment
Other inspection equipment and devices

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[Case Study] X-ray Fluoroscopy and CT Examination Equipment

Numerous examples of "BGA solder crack analysis," "surface mount LEDs," and "chip resistor observation" using X-ray fluoroscopy and angled CT observation are included!

In this document, we introduce various analysis cases conducted by our company using X-ray fluoroscopy and CT inspection equipment. It includes examples such as "BGA solder crack analysis case" from X-ray fluoroscopic observation and oblique CT observation, as well as cases of "surface mount LEDs" and "chip resistors." 【Contents (excerpt)】 ■ BGA solder crack analysis case (X-ray fluoroscopic observation) ■ Surface mount LEDs ■ Chip resistor observation case ■ Reflow simulator ■ Microphone observation case (X-ray fluoroscopic observation & orthogonal CT observation)... ★ Currently offering the 【X-ray fluoroscopy and CT inspection equipment case collection】 for free! You can view it immediately from the "PDF download." *For more details, please refer to the PDF document or feel free to contact us.

Company：アイテス
Price：Other

X-ray inspection equipment
Contract Inspection
Contract Analysis

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Observation of aluminum welding joints

Introducing examples of aluminum welding observation. Internal observation through X-ray fluoroscopy and CT inspection allows for clearer observation after cross-section preparation!

Here are some examples of observations of aluminum spot welds. In internal observations using X-ray radiography, voids were observed inside the weld, and in internal observations using X-ray CT, it was confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching treatment, we were able to observe the condition of the weld more clearly. 【Overview】 ■ Internal observation using X-ray radiography - Non-destructive testing and X-ray radiographic observation were conducted - Voids were observed inside the weld ■ Internal observation using X-ray CT - Non-destructive testing and X-ray CT observation were conducted - It was confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section suitable for the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.