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  1. Home
  2. Electronic Components and Semiconductors
  3. アイテス
Electronic Components and Semiconductors
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アイテス

EstablishmentJanuary 1, 1993
capital3000Ten thousand
number of employees106
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
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last updated:Nov 27, 2025
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  • Products/Services(352)
  • catalog(352)
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アイテス Company Overview

We are an analytical company that responds with advanced technical skills, based on the principle of "strict confidentiality for our clients."

Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

Business Activities

【Analysis and Reliability Evaluation Business】  ■ Analysis and evaluation from data collection of various electronic components to failure analysis  ■ Evaluation of raw materials and characteristics in research and development and manufacturing 【Inspection Equipment Development Business】  ■ Development and sales of solar panel inspection and measurement instruments 【Electronic Equipment Repair Business】  ■ Repair of industrial equipment and computers 【Wafer Processing Business】  ■ Wafer processing services and sales

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Products/Services (352)

Ultrasonic microscope observation of printed circuit boards. product image
Ultrasonic microscope observation of printed circuit boards.
Measurement of specific surface area of powdered zeolite by the BET method. product image
Measurement of specific surface area of powdered zeolite by the BET method.
Confirmation of chiplet package structure by mechanical polishing. product image
Confirmation of chiplet package structure by mechanical polishing.
Ultrasonic microscope observation of semiconductor packages product image
Ultrasonic microscope observation of semiconductor packages

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catalog(352)

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Ultrasonic microscope observation of printed circuit boards

Ultrasonic microscope observation of printed circuit boards

TECHNICAL
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Measurement of the specific surface area of powdered zeolite using the BET method.

Measurement of the specific surface area of powdered zeolite using the BET method.

TECHNICAL
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Confirmation of chiplet package structure by mechanical polishing.

Confirmation of chiplet package structure by mechanical polishing.

TECHNICAL
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Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of semiconductor packages

TECHNICAL
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news(108)

アイテス ロゴ.png

Measurement of specific surface area of powdered zeolite by the BET method.

  • PRODUCT

Our company conducts specific surface area measurements of powdered zeolite using the BET method. In addition to powdered zeolite, it can also be used for specific surface area measurements of catalysts and activated carbon, and by utilizing other applications, it is possible to measure not only specific surface area but also pore distribution. Furthermore, particle size and pore distribution can be evaluated using methods and equipment other than those mentioned. For more details, please refer to our catalog.

Mar 12, 2026

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chip structure confirmation.png.png

Confirmation of chiplet package structure by mechanical polishing.

  • PRODUCT

Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation results. *For more details, please download the PDF or feel free to contact us.*

Mar 05, 2026

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Observation of adhesive conditions through a metal plate using an ultrasonic microscope.

  • PRODUCT

Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.

Jan 22, 2026

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Detailed information

Company name アイテス
number of employees106
Contact addresspostalcode 520-2151 Shiga/ Otsu-shi/ 1-60 Kuribayashi TownView on map TEL:077-599-5015 FAX:077-544-7710
Industry Electronic Components and Semiconductors
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