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  1. Home
  2. Electronic Components and Semiconductors
  3. アイテス
Electronic Components and Semiconductors
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アイテス

EstablishmentJanuary 1, 1993
capital10000Ten thousand
number of employees92
addressShiga/Otsu-shi/1-60 Kuribayashi Town
phone077-599-5015
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last updated:Jul 02, 2025
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  • Products/Services(353)
  • catalog(349)
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アイテス Company Profile

We are an analytical company that responds with advanced technical skills, based on the principle of "strict confidentiality for our clients."

Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

Business Activities

【Analysis and Reliability Evaluation Business】  ■ Analysis and evaluation from data collection of various electronic components to failure analysis  ■ Evaluation of raw materials and characteristics in research and development and manufacturing 【Inspection Equipment Development Business】  ■ Development and sales of solar panel inspection and measurement instruments 【Electronic Equipment Repair Business】  ■ Repair of industrial equipment and computers 【Wafer Processing Business】  ■ Wafer processing services and sales

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Products/Services (353)

Moisture and heat resistance test for adhesive product image
Moisture and heat resistance test for adhesive
State analysis of cathode active materials using XPS. product image
State analysis of cathode active materials using XPS.
Example of failure analysis of chip resistors product image
Example of failure analysis of chip resistors
Evaluation of the rebound and vibration absorption properties of rubber materials product image
Evaluation of the rebound and vibration absorption properties of rubber materials

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catalog(349)

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Moisture and heat resistance test for adhesive

Moisture and heat resistance test for adhesive

TECHNICAL
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Analysis of the state of cathode active materials using XPS.

Analysis of the state of cathode active materials using XPS.

TECHNICAL
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Example of failure analysis of chip resistors

Example of failure analysis of chip resistors

TECHNICAL
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Evaluation of the rebound and vibration absorption properties of rubber materials.

Evaluation of the rebound and vibration absorption properties of rubber materials.

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news(99)

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Moisture and heat resistance test for adhesive

  • PRODUCT

Our company conducted a "moisture and heat resistance test for adhesives" to investigate changes in adhesive strength due to the effects of moisture and heat. Test specimens were placed in a constant temperature and humidity testing machine, and after 500 hours, they were removed to measure the tensile shear adhesive strength. It is presumed that the adhesive strength decreased due to the swelling of the adhesive in a high temperature and high humidity environment. We can conduct various environmental tests and strength tests on a wide range of materials, not just adhesives. Additionally, we also provide chemical analysis to clarify degradation mechanisms.

Sep 10, 2025

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Notice of Participation in the 2nd "[Kyushu] Semiconductor Industry Exhibition" on October 8 (Wednesday) and 9 (Thursday), 2025.

  • SEMINAR_EVENT

Aites Co., Ltd. will be exhibiting at the 2nd "[Kyushu] Semiconductor Industry Exhibition" held at Marine Messe Fukuoka Hall A and B in Fukuoka City, Fukuoka Prefecture. We will be introducing our analysis technology services, so please feel free to stop by. We sincerely look forward to your visit.

Sep 09, 2025

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Analysis of the state of cathode active materials using XPS.

  • PRODUCT

NMC (Li(NixMnyCoz)O2) is used as a positive electrode active material in lithium-ion batteries. Regarding the NMC reagent, an evaluation of the valence of metal oxides was conducted through state analysis using XPS. As a result of the analysis, the NiMnCo ratio obtained is close to the specifications of the reagent. Additionally, F and C, which are believed to originate from the binder component, have been detected.

Sep 05, 2025

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Detailed information

Company name アイテス
number of employees92
Contact addresspostalcode 520-2151 Shiga/ Otsu-shi/ 1-60 Kuribayashi TownView on map TEL:077-599-5015 FAX:077-544-7710
Industry Electronic Components and Semiconductors
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