Observation of adhesive conditions through a metal plate using an ultrasonic microscope.
Here is an introduction to a case where the adhesive condition was observed through a metal plate using an ultrasonic microscope.
The ultrasonic microscope can reveal internal information that cannot be confirmed from the appearance, as long as the ultrasonic waves can pass through the material.
After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details and results of the observations.

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