Troubles with Flux Cleaning Due to High-Density Component Mounting [Case Study]
Along with a case study on cleaning defects due to high-density implementation, we will also provide guidance on methods for restructuring the cleaning process!
We would like to introduce a case study on the investigation of factors leading to cleaning failures due to flux cleaning troubles caused by the high density of component mounting. With the increase in the density of component mounting, a change in the solder paste used was made, but there have been reports of defects believed to be caused by cleaning issues. Based on the information gathered, we inferred the current situation. We conducted an analysis and evaluation of the hypotheses and proposed both temporary and permanent measures tailored to the customer's circumstances based on the results. [Case Overview] ■ Issues - Cleaning performance of flux in low stand-off areas ■ Conclusion - Stable operation is difficult under the current cleaning conditions ■ Permanent improvement measures and proposals - Review of cleaning agents and cleaning processes suitable for the work shape and flux *For more details, please download the PDF or feel free to contact us.
- Company:ゼストロンジャパン
- Price:Other