Hydrogen annealing device (for electronic devices, currently supporting sample testing)
Uniform heating in atmospheric pressure hydrogen atmosphere. Providing flexible hard support and sample testing with abundant experience and track record for thin films, wafers, compound, and ceramic substrates.
Maximizing the reducing power of hydrogen to achieve high-quality thin films and substrate surfaces that are unprecedented. Ideal for thermal processing (bake and anneal) of delicate compound devices and dielectric substrates. High reliability supported by proven results and experience ensures safety. Responding from the initial stage, including testing, based on extensive achievements in enhancing the quality of electrodes and wiring films, controlling the resistance and stress of high melting point metal films, and end processing of polished wafers for special applications.
- Company:神港精機 東京支店
- Price:Other