Achieve high precision and high efficiency processing! Introducing grinding wheels that use metal bond as the binder.
The "Chamfering (Outer Circumference) Wheel" is a grinding wheel for chamfering silicon wafers.
It uses a metal bond as the binder, achieving high precision and high efficiency processing. It accommodates various specifications such as V shapes, R shapes, single grooves, and continuous grooves.
We have processing examples with a particle size of #800, a wheel peripheral speed of 2500 m/min, and a surface roughness (Ra) of 0.3 μm.
Please feel free to contact us when you need assistance.
【Features】
■ For chamfering processing of silicon wafers
■ Uses metal bond as the binder
■ Achieves high precision and high efficiency processing
■ Accommodates various shapes, single grooves, continuous grooves, and rough/finish integrated types
*For more details, please refer to the PDF document or feel free to contact us.