Achieve high precision and high efficiency processing! Introducing grinding wheels that use metal bond as the binder.
The "Chamfering (Outer Circumference) Wheel" is a grinding wheel for chamfering silicon wafers. It uses a metal bond as the binder, achieving high precision and high efficiency processing. It accommodates various specifications such as V shapes, R shapes, single grooves, and continuous grooves. We have processing examples with a particle size of #800, a wheel peripheral speed of 2500 m/min, and a surface roughness (Ra) of 0.3 μm. Please feel free to contact us when you need assistance. 【Features】 ■ For chamfering processing of silicon wafers ■ Uses metal bond as the binder ■ Achieves high precision and high efficiency processing ■ Accommodates various shapes, single grooves, continuous grooves, and rough/finish integrated types *For more details, please refer to the PDF document or feel free to contact us.
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【Standard Specifications】 ■Abrasive: SD ■Grain size: #400 to #2000 ■Concentration: 75 to 125 ■Bond ・Standard: MNK016 ・Durability-focused: MNK018 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Adamas Corporation manufactures and sells industrial diamond grinding wheels. Since its establishment, we have earned the trust of our customers by aiming for high quality, short delivery times, and low costs. We will continue to focus on each product to ensure customer satisfaction.