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Heat dissipation sheet Product List and Ranking from 19 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

Heat dissipation sheet Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

  1. Ally Japan 横浜本社 Kanagawa//Electronic Components and Semiconductors
  2. 日本旭立科技 Osaka//Resin/Plastic
  3. SATSUMASOUKEN CO.LTD Kagoshima//Building materials, supplies and fixtures
  4. 4 KGK 共同技研化学 埼玉県所沢本社・工場、群馬県富岡工場、東京都池袋事業所 Saitama//Chemical
  5. 5 五洋紙工 Osaka//Resin/Plastic

Heat dissipation sheet Product ranking

Last Updated: Aggregation Period:Jan 28, 2026~Feb 24, 2026
This ranking is based on the number of page views on our site.

  1. ☆Free sample available☆ Flexible heat dissipation sheet <HXXX series> Ally Japan 横浜本社
  2. High-reliability thermal conductive resin "Thermo Rubber (R)" SATSUMASOUKEN CO.LTD
  3. Transparent Heat Dissipation Sheet "HTA02TX" KGK 共同技研化学 埼玉県所沢本社・工場、群馬県富岡工場、東京都池袋事業所
  4. 4 Graphene heat dissipation material "Graphene Flower SP" 進和 戦略営業推進室
  5. 4 Heat-dissipating sheet Acrylicool TM <prototype> 五洋紙工

Heat dissipation sheet Product List

1~30 item / All 32 items

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Silicone-free heat dissipation sheet "Efco TM Sheet"

High-performance thermal conductive sheet that prevents the generation of low molecular weight siloxanes and prevents issues such as contact failure.

The "Efco TM Sheet" is a high-performance heat dissipation sheet made from materials such as acrylic rubber and TPE (thermoplastic elastomer). It does not generate low molecular weight siloxanes, preventing issues such as contact failure. All products comply with RoHS regulations and do not contain harmful substances such as halogens, lead, or fluorocarbons. 【Features】 ■ Siloxane-free ■ Environmentally friendly ■ Low VOC (volatile organic compounds) *For more details, please refer to the PDF materials or feel free to contact us.

  • Other consumables
  • Heat dissipation sheet

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"Super" high thermal conductivity heat dissipation sheet Thermo-TranzM50α

A high heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion of polymers.

It is used by placing it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● A high thermal conductivity sheet made in Japan, unlike any other. ● A heat dissipation sheet that maintains both flexibility and adhesion. ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs. ● Operating temperature range is from -40°C to 150°C, and it is resistant to heat cycles. ● Excellent handling properties.

  • Other electronic parts
  • Heat dissipation sheet

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Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzUTW

A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.

It is used by inserting it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● High thermal conductivity sheet made in Japan ● The low molecular siloxane content is kept below 70 ppm, allowing for use near contacts such as switches. ● It has a type that retains polymer-derived adhesiveness, providing double-sided adhesion, making it a high thermal conductivity sheet with excellent fixation and followability. The presence of some adhesive on both sides enhances adhesive performance and makes handling easy. (The adhesive strength is strong.) ● A heat dissipation sheet that maintains a balance of flexibility and adhesion ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs. ● The operating temperature range is -40°C to 150°C, and it is a sheet that is also resistant to heat cycles.

  • Other electronic parts
  • Other polymer materials
  • Heat dissipation sheet

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Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzVW

A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.

It is used by placing it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● High thermal conductivity sheet made in Japan ● Enables cooling of high heat-generating areas such as CPUs, GPUs, and high energy density LEDs, while keeping the low molecular siloxane content below 70 ppm, making it suitable for use near contacts like switches. ● It is a type that provides double-sided adhesion by retaining polymer-derived stickiness, resulting in a high thermal conductivity sheet with excellent fixation and followability. The presence of some adhesive on both sides increases adhesive performance and makes handling easy. (The adhesive strength is strong.) ● A heat dissipation sheet that maintains both flexibility and adhesion ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high energy density LEDs. ● The operating temperature range is from -40°C to 150°C, and it is a sheet that is also resistant to heat cycles.

  • Other electronic parts
  • Other polymer materials
  • Heat dissipation sheet

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Sekisui Chemical Co., Ltd. APCS Exhibition Information

Exhibiting at APCS (Advanced Packaging and Chiplet Summit)!

Sekisui Chemical Co., Ltd. will exhibit at the APCS (Advanced Packaging and Chiplet Summit) held from December 14 to December 16. December 14 (Wednesday) - 16 (Friday) 10:00-17:00 at Tokyo Big Sight (East Halls 1, 2, 3) Sekisui Chemical Co., Ltd. exhibition area: East Hall 3 side (3850) Sekisui Chemical offers a wide range of functional resin products in various forms, including tapes, films, thermal interface materials, fine particles, encapsulants, and clean containers, which can be used in semiconductor backend processes and various substrates (PCB, FPC, package substrates). In response to the increasingly advanced needs of the semiconductor industry, such as fine wiring, high-density design, 3D integration, and thin film technology, we provide high-performance products based on technologies such as adhesive control, uniform particle synthesis, thin film coating, and precision multilayer extrusion. Exhibited products: - High-adhesion, easy-peel UV tape SELFA - High thermal conductivity heat dissipation sheet MANION series - Clean UN bottle series - Water-soluble polymer for surface protection We have prepared various products to meet the cutting-edge needs related to semiconductors. Please feel free to visit our booth.

  • Plastic utensils and containers
  • Heat dissipation sheet

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Insulating and heat-dissipating material, insulating and heat-dissipating sheet.

Excellent mechanical durability and penetration resistance! High electrical durability!

Insulating and Heat Dissipating Materials: Insulating and heat dissipating sheets are designed to achieve the required insulating and heat dissipating properties for applications at a low cost. Additionally, they are reinforced with a fiberglass cloth layer, enhancing their strength against breakage, penetration, and bending. The products are available in rolls or die-cut shapes. Optionally, adhesive tape can be added to one or both sides. Due to their long product lifespan, they are adopted in many fields, including the automotive and electronics industries. For more details, please contact us or refer to the catalog.

  • Composite Materials
  • Heat dissipation sheet

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Graphene heat dissipation material "Graphene Flower SP"

A quarter the weight of copper! It has high heat dissipation performance that balances high thermal conductivity and thickness.

The "Graphene Flower SP" has high heat dissipation performance that balances high thermal conductivity and thickness. It is 1/4 the weight of copper (density 2.2g/cm3) and allows for control of the direction of thermal conductivity. Additionally, compared to conventional thin graphite, it achieves extremely high heat dissipation performance due to the effect of thickness. 【Features】 ■ High heat dissipation performance that balances high thermal conductivity and thickness ■ 1/4 the weight of copper (density 2.2g/cm2) ■ Directional control of thermal conductivity is possible ■ Extremely high heat dissipation performance can be achieved due to the effect of thickness *For more details, please refer to the PDF document or feel free to contact us.

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Heat dissipation sheet COH series

Taika Sheet-type Thermal Conductive Gel λ (Lambda) Gel COH Series

It is a sheet-type heat dissipation material that is placed in the gaps between heating elements and cooling components such as heat sinks to eliminate air pockets.

  • Other polymer materials
  • Other electronic parts
  • Heat dissipation sheet

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High-reliability thermal conductive resin "Thermo Rubber (R)"

Extremely high flexibility and high-reliability thermal conductive resin that combines insulation and thermal conductivity!

"Thermal Rubber (R)" is a highly reliable thermal conductive resin that absorbs stress generated between materials with different thermal expansion coefficients, enhancing the reliability of the product. It conforms to surface irregularities, adheres closely, and quickly dissipates heat from the heating element to the heat dissipation (housing) area. Additionally, by incorporating a special filler and dispersing it uniformly, we have achieved a high thermal conductivity. [Features] - High flexibility - High thermal conductivity - High compressibility - Stress absorption, etc. *For more details, please download the PDF or feel free to contact us.

  • glue
  • Heat dissipation sheet

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Graphene TEM grid

By applying hydrophilic treatment, a very thin and uniform layer of ice can be formed!

This product is a groundbreaking TEM grid made of high-purity CVD-synthesized two-layer graphene self-supporting film. It is suitable as a sample support film for transmission electron microscopy observation of ultrafine particles and viruses. By applying hydrophilization treatment, it can form a very thin and uniform layer of ice. Additionally, hydrophilized graphene TEM grids are also available. 【Features】 - Groundbreaking TEM grid made of high-purity CVD-synthesized two-layer graphene self-supporting film - Suitable as a sample support film for transmission electron microscopy observation of ultrafine particles and viruses - Can form a very thin and uniform layer of ice through hydrophilization treatment - Hydrophilized graphene TEM grids are also available *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Heat dissipation sheet

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Repoly Super Low Oil Bleed Ultra Soft Heat Dissipation Sheet AS Series

An ultra-soft heat dissipation sheet that has no oil bleed even in a highly compressed state. UL flame retardant and RoHS compliant. [Catalog available]

AS200/AS400 is a gap-filling material with a high thermal conductivity of 2.0/40W/m*K. Due to its high flexibility, high compressibility, and resistance to oil bleed, the amount of oil bleed is extremely low even under high compression conditions. 【Features】 ◆ Oil contamination and appearance dirt caused by oil bleed and the adhesion of dust to electronic devices can be avoided. ◆ UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • plastic
  • Composite Materials
  • Heat dissipation sheet

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Repoly high-compression non-silicone heat dissipation sheet Repoly N700

It is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials, and the volatile substances due to heating are extremely low compared to acrylic-based materials.

◆This is a special heat dissipation material that shows superior heat dissipation effects compared to acrylic-based materials. It has a high thermal conductivity (1.5/3.0 W/mK). ◆The thermal resistance value of the material itself is lower than that of acrylic-based materials, allowing for faster heat conduction. ◆Not only does it have minimal volatile substances due to heating, but it also has significantly fewer compared to acrylic-based materials. ◆Due to the use of high compressibility technology, the force required for compression is extremely small, and the wide heat dissipation area allows for faster heat conduction. ◆It has a double-sided mild adhesive property, excellent adhesion, and is convenient to work with. ◆Since mold shaping is done in-house, we can accommodate detailed specifications for sheet shapes, mold shaping, and cutting. ◆UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • Heat dissipation sheet

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Graphene heat dissipation material "Graphene Flower SP"

This is a high-performance heat sink that achieves both high thermal conductivity and thickness. The direction of heat conduction can be controlled either in the plane direction or in the vertical (thickness) direction.

This is a heat dissipation plate made from high-oriented graphite, which has been graphitized using a unique molding technology with graphene as the raw material, and can be cut to any thickness. It has a thermal conductivity of over twice that of copper (700-1000 W/m·K), is lightweight with a bulk density of one-fourth that of copper (2.2 g/cm³), and excels in sound wave permeability. You can choose between the XY type with high thermal conductivity in the plane direction and the XZ type with high thermal conductivity in the vertical (thickness) direction. Its machinability is the same as that of general graphite, and it can be processed using grinding wheels and milling machines. It is also possible to process and deliver it in the specified shape within the designated size. Prototypes can be made from a single piece. For details, we will propose the optimal heat dissipation material after consultation. Applications: Heat transfer in the thickness direction for high-output devices such as inverters (thickness of 2 mm or more), heat dissipation plates for thermal diffusion requiring a thickness of 1 mm or more, and other heat dissipation plates requiring thickness for smartphones, laptops, tablets, etc.

  • Other polymer materials
  • Heat dissipation sheet

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Heat dissipation sheet

Both silicone-based and elastomer-based materials can be handled! It is also possible to process by cutting out from sheets.

Baoyou Rubber handles "heat dissipation sheets." We can work with both silicone-based and elastomer-based materials. Additionally, we can mold from materials with excellent heat dissipation properties. Furthermore, we can also perform cutting processes from sheets. If you are having trouble with heat dissipation, please feel free to consult us. 【Features】 ■ Can be molded from materials with excellent heat dissipation properties ■ Cutting processes from sheets are also possible *For more details, please refer to the PDF document or feel free to contact us.

  • Rubber
  • Heat dissipation sheet

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Latest technology: High-performance insulating SiC and BN heat dissipation sheets.

High performance! Insulation and heat dissipation sheet with excellent high-temperature characteristics!

The latest technology, high-performance insulating SiC/BN thermal conductive sheets, are high-performance thermal conductive sheets composed of a mixture of insulating SiC, featuring excellent insulation properties at high temperatures (above 80°C). For more details, please contact us or refer to the catalog.

  • others
  • Ceramics
  • Heat dissipation sheet

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Graphene sheet "Monolayer graphene film"

Graphene is expected to have a wide range of applications, starting with post-silicon uses!

The "monolayer graphene film" is a graphene sheet produced by Graphenea, a Spanish company that manufactures world-class graphene sheets using the CVD method. The featured product is a monolayer graphene measuring 1.5 cm square on a 2 cm square SiO2 substrate. Sizes and types of substrates can be customized according to your needs. Additionally, it is possible to synthesize bilayer and multilayer graphene. This product is expected to have a wide range of applications beyond post-silicon, so please consider it as a potential aid for your future research. 【Features】 ■ Customizable according to user requirements ■ Capable of synthesizing bilayer and multilayer graphene ■ Expected to accommodate a wide range of applications *For more details, please refer to the catalog or feel free to contact us.

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Transparent Heat Dissipation Sheet "HTA02TX"

It is a transparent adhesive gel sheet that combines transparency and heat dissipation.

It is a one-sided adhesive sheet made of transparent heat-emitting film material. It has excellent transparency. It has excellent surface thermal conductivity. It has stable properties.

  • power supply
  • Other FPD related
  • Composite Materials
  • Heat dissipation sheet

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Heat Dissipation Sheet CW Series

Heat dissipation sheet CW series

Heat dissipation sheet using Sarcon (Sarcon is a registered trademark of Fuji Polymer Industries Co., Ltd.)

  • transformer
  • Printed Circuit Board
  • Other electronic parts
  • Heat dissipation sheet

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Directly synthesized multilayer graphene, graphene flower.

Lump-like graphene synthesized without a substrate and without a catalyst, resembling flower petals.

Directly synthesized multilayer graphene, known as "graphene flower," is a bulk graphene synthesized without a substrate or catalyst using the InALA method. The shape immediately after synthesis resembles a flower, which is why it is marketed under the product name (trademarked) "graphene flower." Each individual layer, which looks like a petal, is graphene. This is not obtained by exfoliating from graphite or expanding intercalated compounds, but rather through a bottom-up approach that directly synthesizes the graphene material. The InALA method allows for the direct synthesis of single to few-layer graphene. For more details, please contact us or refer to the catalog.

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Thermal Interface Material (TIM)

We have processing experience with boards for earth and sensors! The "softness" makes processing and handling difficult.

To soften TIM materials (thermal interface materials), it is necessary to reduce the resistance between different materials, while maintaining electrical insulation (with some components requiring conductivity) and achieving low thermal resistance. For example, there is a concept of directly bonding metal materials using silver or copper paste without TIM materials in between. However, when dealing with dissimilar materials, the surface roughness of each material creates gaps that can trap air, resulting in increased thermal resistance. To expel this air, TIM is inserted, and softness is required to easily fill these gaps, but this "softness" complicates processing and handling. [Main Processing Achievements] ■ Information Communication: Antennas, grounding, LCD conduction, noise countermeasures ■ Automotive: Sensor substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other polymer materials
  • Heat dissipation sheet

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Heat-dissipating sheet Acrylicool TM <prototype>

Our company's developed non-silicone, acrylic-type heat dissipation sheet (thermal conductive sheet) has undergone a complete lineup renewal!

- Acrylic resin-based sheet with excellent thermal conductivity and electrical insulation properties - Silicone-free, does not generate low molecular siloxanes that can cause contact failure - Top-class heat resistance temperature of 130°C as an acrylic thermal dissipation sheet - Available in double-sided adhesive type W and single-sided adhesive type S, allowing selection based on application - Customization is possible to meet your needs. Please feel free to contact us.

  • Heat exchanger
  • plastic
  • Heat dissipation sheet

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Incredible heat dissipation! Ultra-soft ultra-high thermal conductivity value 15W/mK heat dissipation sheet.

This is a heat dissipation material that achieves both ultra-softness (Shore000) and ultra-high thermal conductivity (15.0W/m*K). [Catalog available]

◆ It has an ultra-high thermal conductivity of 15.0 W/mK. ◆ With ultra-high compressibility, a compression force of 50 psi achieves a volume compression rate of 79%, resulting in low thermal resistance (1.0 mm thickness). ◆ This is a thermal conductive material that combines ultra-softness (Shore 000) with ultra-high thermal conductivity (15.0 W/m*K). ◆ Due to its ultra-high compressibility, it can easily fill tiny gaps and conduct heat at an extremely fast rate between the heating element and the heat sink or housing. Since mold forming is done in-house, we can accommodate detailed requests regarding sheet shape, mold forming, cutting specifications, etc. ◆ UL flame retardant and RoHS compliant. *For more details, please download the catalog or feel free to contact us.

  • Other polymer materials
  • Heat dissipation sheet

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Heat dissipation sheet "PK Series"

We can also accommodate forming through customization.

The "PK Series" is a gap-filling thermal interface material with a thermal conductivity of 2.0-7.0 W/m*K. It has a hardness of Shore OO/30-50, and possesses flexibility, compressibility, insulation properties, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. Additionally, our sheets can be customized for forming. Please feel free to consult us if you have any requests. 【Product Lineup】 ■PK223 ■PK404 ■PK504 ■PK605 ■PK700 *For more details, please download the PDF (English version) or feel free to contact us.

  • others
  • Heat dissipation sheet

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Heat dissipation sheet "BS Series"

We can provide customers with special needs for cutting-edge products.

The "BS Series" is a thermal conductive sheet that is very soft and elastic, with excellent resistance to deformation. It can prevent deformation of components such as PCBs due to assembly stress. With a thermal conductivity of 3.0-5.0 W/m*K, this gap-filling thermal material has a hardness of Shore OO/10-25, and features flexibility, compressibility, insulation, and self-adhesiveness, effectively filling design tolerances in mechanisms and demonstrating high stability. 【Series Lineup】 ■BS75K ■BS87-S ■BS89 ■S282-s *For more details, please download the PDF (English version) or feel free to contact us.

  • others
  • Heat dissipation sheet

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☆Free sample available☆ Flexible heat dissipation sheet <HXXX series>

This is a cooling heat sheet characterized by high thermal conductivity and flexible processing properties. Thermal sheets have seen increased demand in recent years, so please be sure to try our free sample.

★Product Features★ ーーーーーーーーーーーーーーーーーーーーーーーーー ● High flexibility and workability ● One-stop service including shape processing ● Low thermal resistance ● High compressibility ● Excellent thermal insulation ーーーーーーーーーーーーーーーーーーーーーーーーー ★Product Description We offer heat sheets as components for heat dissipation measures. They are widely used for heat dissipation in automotive applications, smartphones, optical devices, and more. This cooling sheet complies with RoHS 2.0, is halogen-free, flame-retardant UL, and meets REACH standards. It is also compatible with chemSHERPA. Not only available in sheet form, but we can also process and deliver them in your desired shape. By performing manufacturing and processing as a one-stop service, we enable high-quality quality control tailored to the material's characteristics, while achieving total cost reduction that includes processing. They are widely used for improving the heat dissipation efficiency of heat sinks and addressing heat issues in packaged components. Problems caused by heat often arise in relatively later stages of development, making these materials valuable for heat measures that minimize rework. They are commonly used in combination with air cooling fans and other devices.

  • Other electronic parts
  • Heat dissipation sheet

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【Heat Dissipation Sheet】 High thermal conductivity, noise reduction, silicone-free, etc.

We handle a wide range of thermal conductivity materials and heat dissipation sheets that can absorb electromagnetic waves, and we will propose suitable materials based on your desired specifications. *Samples are available upon request.

Our company purchases a wide variety of thermal conductive sheets from multiple manufacturers and processes suitable materials according to our customers' needs. If you are having trouble with shape processing, whether you are an end user or a material manufacturer, please feel free to contact us. 【Thermal Conductive Sheets We Handle】*Partial Excerpt ■ Thermal conductive sheets with thermal conductivity in the vertical direction (thickness direction) ■ Thermal conductive sheets with high thermal conductivity of "30 W/m·K" or more ■ Thermal conductive sheets that can counteract noise ■ Silicone-free thermal conductive sheets ★ If you would like a sample, please request it through the inquiry form. *For more details, please refer to the PDF document or feel free to contact us.

  • Other electronic parts
  • Heat dissipation sheet

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Numerous achievements in graphite sheet processing! Introduction of application examples.

We also have production equipment capable of continuous laminate processing! Here are some examples of the use of graphite sheets.

"Graphite sheets" are lightweight materials with very high thermal conductivity in the plane direction. *Thermal conductivity (about 4 times that of copper, about 7 times that of aluminum). While they have a large thermal diffusion capacity, the material itself is very brittle, making it very difficult to handle in processing due to issues such as powdering and interlayer delamination. However, our company can provide products tailored to customer needs by solving such challenges based on our extensive processing experience. [Adoption Examples] ■ Electronic devices (automotive, smartphones, portable game consoles, laptops, etc.) ■ Module components (LCD, OLED, etc.) ■ Other applications such as thermal diffusion, heat dissipation, heat spot relief, and temperature uniformity. *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Heat dissipation sheet

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