Japan-made ultra-high thermal conductivity heat dissipation sheet Thermo-TranzUTW

A heat dissipation sheet that utilizes the high thermal conductivity of carbon fibers through a unique magnetic field orientation technology, while maintaining the flexibility and adhesion properties of polymers.

It is used by inserting it between heat-generating components (such as CPU, GPU, LED, etc.) and heat-dissipating components (such as heat sinks), efficiently conducting heat from the heat-generating components to the heat-dissipating components. 【Features】 ● High thermal conductivity sheet made in Japan ● The low molecular siloxane content is kept below 70 ppm, allowing for use near contacts such as switches. ● It has a type that retains polymer-derived adhesiveness, providing double-sided adhesion, making it a high thermal conductivity sheet with excellent fixation and followability. The presence of some adhesive on both sides enhances adhesive performance and makes handling easy. (The adhesive strength is strong.) ● A heat dissipation sheet that maintains a balance of flexibility and adhesion ● Ideal for cooling high heat-generating areas such as CPUs, GPUs, and high-energy-density LEDs. ● The operating temperature range is -40°C to 150°C, and it is a sheet that is also resistant to heat cycles.

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