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SDGs in Electronic Device Cleaners [Free Technical Document Download]

Balancing cleanliness and safety! A must-read for reviewing electronic device cleaning agents.

This document explains the requirements for electronic devices to achieve the SDGs and how cleaning of electronic devices should be approached from the perspective of the SDGs. It is recommended for those who are concerned about wanting to achieve "cleaning that balances low-risk performance and cleaning performance" or wanting to know "the cleaning technologies required for electronic devices." We have included content on "Cleaning of electronic devices and the SDGs" and "The need for low-risk cleaning agents for electronic devices," so please take a moment to read it. 【Contents (partial)】 ■ Introduction ■ Cleaning of electronic devices and the SDGs ■ The need for low-risk cleaning agents for electronic devices ■ Cleaning performance required for electronic device cleaning agents ■ "Chemical analysis" to ensure more reliable cleaning *For more details, please refer to the PDF document or feel free to contact us.

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What is an SDS (Safety Data Sheet)?

Explanation of essential knowledge for evaluating, purchasing, and storing flux cleaning agents!

An SDS (Safety Data Sheet) is a document that contains important information regarding the handling of chemical substances, relevant regulations, disposal and transportation methods, as well as hazards and toxicity. The applicable regulations for flux cleaning agents, whether they have a flash point, precautions for use, the necessity of protective equipment, and disposal methods are detailed over more than 10 pages. In this article, we will explain important points that we particularly want you to pay attention to, as well as frequently asked questions. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

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Basic Knowledge of Flux Cleaning [Materials Being Distributed]

A clear explanation of the basics of flux cleaning, including the differences in cleaning agents and how to consider cleaning methods, which you may feel hesitant to ask about now!

This document explains the types and selection methods of cleaning agents and cleaning methods that are important when considering flux cleaning. It includes points to consider when examining flux cleaning methods, as well as discussions on the cleaning and rinsing processes and the drying process, providing a foundational understanding of flux cleaning. This is a useful resource for those who want to switch flux cleaning agents or are looking to start flux cleaning. 【Contents】 ■ What is flux cleaning? ■ Types and selection methods of cleaning agents - Water-based cleaning agents - Solvent-based cleaning agents *For more details, please refer to the PDF document or feel free to contact us.

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Manual Circuit Board Cleaner / Quick Cleaning & Drying VIGON EFM

No-clean solder is also effective! Significantly reduces working time in hand-wipe cleaning.

"VIGON EFM" is a hand-wipe cleaning agent that effectively cleans and dries quickly. It significantly reduces the working time for hand-wipe cleaning, with some cases showing a reduction to less than half the time. It is also effective on no-clean solder. It can be used for rework and repair cleaning as well. It is a halogen-free organic solvent that dries quickly and leaves no residue. Furthermore, it is non-corrosive and compatible with most polymers. Please feel free to contact us for inquiries. *For more details, please refer to the PDF document or feel free to reach out to us.

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Water-based flux cleaner for power semiconductors VIGON PE215N

No ignition point! Prevents re-oxidation of copper substrates with effective rinsing! Long-term protection of activated copper substrates.

"VIGON PE 215N" is a neutral water-based cleaning agent specifically designed for spray cleaning devices. Thanks to MPC technology, it can reliably remove flux residues from power electronics components, making it particularly suitable for cleaning power modules after die attachment and heat sink soldering. Additionally, it excels in material compatibility and the removal of copper oxide films, which enhances the subsequent processes of wire bonding/adhesive bonding and molding, as it is also effective in removing oxide films from copper substrates. 【Features】 ■ Excellent for cleaning flux from power electronics and power modules ■ Provides activated copper substrates for applications such as adhesive bonding ■ pH neutral, with excellent material compatibility with dies, and does not damage passivation ■ No flash point or foaming, making it suitable for spray cleaning machines without explosion-proof specifications *For more details, please refer to the PDF document or feel free to contact us.

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Why is flux cleaning necessary?

Here are some points to consider when contemplating flux cleaning!

Flux cleaning refers to the act of selectively removing substances from the surface of a workpiece (the item being cleaned) that are intended to be eliminated. In other words, flux cleaning means removing flux residues (contaminants) while protecting components such as printed circuit boards, power modules, semiconductor packages, and lead frames. Incidentally, if the removal target includes the work surface and does not have selectivity, it is generally classified as "etching." *For more detailed information, please refer to the related links. For further details, please check the PDF materials or feel free to contact us.*

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

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No more failures! How to choose a flux cleaner [Materials available]

Attention those struggling with flux cleaning! The key to flux cleaning lies in "selecting the right cleaning agent"!

This document explains how to choose flux cleaning agents. It provides specific examples of key points to consider when selecting a flux cleaning agent and highlights the aspects to focus on. It also includes important considerations for water-based cleaning agents, such as controlling evaporation loss and variations in water content, as well as examples of non-cleaning type flux cleaning cases, so please take a moment to read it. [Contents (partial)] ■ Key points when choosing flux cleaning agents ■ Types of flux cleaning agents ■ Important considerations when examining water-based cleaning agents ■ Examples of non-cleaning type flux cleaning *For more details, please refer to the PDF document or feel free to contact us.

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Evaluation Methods for Flux Cleaning / Added Value [Seminar Materials]

An explanation of the latest cleanliness analysis methods and the added value of using flux cleaning agents!

This document provides a detailed explanation of evaluation methods and added value in flux cleaning. It introduces "cleanliness analysis in flux cleaning," as well as "substances to be analyzed," "the impact of residual organic matter," and "the pathways and effects of ion contamination." Additionally, it includes an introduction to Zestron and examples of analytical methods. We encourage you to read it. 【Contents (partial)】 ■ Introduction to Zestron ■ Cleanliness analysis in flux cleaning ■ Substances to be analyzed (flux residues) ■ Substances to be analyzed (residues during sintering) ■ Impact of residual organic matter *For more details, please download the PDF or feel free to contact us.

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Evaluation of cleanliness after cleaning: Analysis methods for flux residues and residues after sintering bonding.

In the cleaning of electronic devices, various factors are intertwined! An explanation of the importance of cleanliness evaluation.

In recent years, the miniaturization and high density of electronic devices have progressed, and along with this, the evolution of the bonding materials used has also coincided, making contamination more complex. In particular, in fields such as automotive, aerospace, space, and high-capacity communication, there is an increasing number of cases that require high reliability, and concurrently, there is a demand for reliable cleaning from the perspective of quality assurance. Inadequate cleaning can lead to issues such as poor wire bonding, poor adhesion of resin in molding, and the occurrence of migration, which is a well-known fact. However, in recent years, there have been many cases where defects occur in later processes despite passing inspections, and we have seen an increase in inquiries to our company regarding this issue. Why do such cases arise? This time, we will explain the importance of cleanliness evaluation after cleaning. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

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Troubles with Flux Cleaning Due to High-Density Component Mounting [Case Study]

Along with a case study on cleaning defects due to high-density implementation, we will also provide guidance on methods for restructuring the cleaning process!

We would like to introduce a case study on the investigation of factors leading to cleaning failures due to flux cleaning troubles caused by the high density of component mounting. With the increase in the density of component mounting, a change in the solder paste used was made, but there have been reports of defects believed to be caused by cleaning issues. Based on the information gathered, we inferred the current situation. We conducted an analysis and evaluation of the hypotheses and proposed both temporary and permanent measures tailored to the customer's circumstances based on the results. [Case Overview] ■ Issues - Cleaning performance of flux in low stand-off areas ■ Conclusion - Stable operation is difficult under the current cleaning conditions ■ Permanent improvement measures and proposals - Review of cleaning agents and cleaning processes suitable for the work shape and flux *For more details, please download the PDF or feel free to contact us.

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