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Laser processing machine Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

Laser processing machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. 藤川伝導機 Tokyo//Industrial Machinery
  2. HSGエンジニアリング Kanagawa//Industrial Machinery
  3. サンダーレーザージャパン 日本本社 Osaka//Industrial Machinery
  4. 4 トロテック・レーザー・ジャパン 本社 Tokyo//Industrial Machinery
  5. 5 null/null
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Laser processing machine Product ranking

Last Updated： Aggregation Period:Sep 10, 2025～Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. Cross-flow two-dimensional laser processing machine "HV2-R PLUS series" 藤川伝導機
  2. CFRP Carbon Dioxide 3D Laser Processing Machine "CV Series" 藤川伝導機
  3. High-performance fiber laser processing machine 'HL2512GS' HSGエンジニアリング
  4. 4 Large Laser Processing Machine "XL Series" 藤川伝導機
  5. 5 Cross-flow two-dimensional laser processing machine "eX PLUS series" 藤川伝導機

Laser processing machine Product List

496～510 item / All 707 items

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Pearl Light Industrial Co., Ltd. Business Introduction

Pearl Light Industrial Co., Ltd. Business Introduction

Consistent production with well-equipped facilities! Leave your metal processing needs to us!

At Pearl Light Industry Co., Ltd., we engage in 2D and 3D laser processing, as well as precision sheet metal and can manufacturing. Through collaboration with our own factory and related companies, we provide a one-stop service from heat treatment such as hardening and tempering to bending and welding processing. We eliminate the need for saw orders, achieving reductions in your time and costs. 【Features】 ■ 2D laser processing accommodating from 28mm to 0.1mm ■ Bending processing with no variation in quality ■ YAG and semiconductor lasers for minimal distortion in finishing *For more details, please download the PDF or feel free to contact us.

  • Processing Contract

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Laser processing

Laser processing

Enhance design subtly with colors that blend well with the material! Delicate designs can also be finished impressively.

"Laser processing" is a method of printing by irradiating laser light onto a material, and since it does not use ink, the color after processing is determined by the material itself. It can be processed on various materials such as paper, resin, and metal, resulting in delicate designs that are impressively finished. The colors blend well with the material, subtly enhancing the design quality. There are also materials that are difficult to process, such as glass, acrylic, and rubber, so please consult us. [Product Examples] ■ Cables ■ Aluminum stands ■ Waterproof cases, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Printing Machinery
  • Contract manufacturing
  • Processing Contract

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Introduction to 3D Laser Processing

Introduction to 3D Laser Processing

Supports various sizes and shapes! 3D laser processing with freely customizable shapes.

Nikken Sangyo Co., Ltd. offers "3D Laser Processing," which realizes the reduction of material waste with optimal processing programs tailored to material shapes. Equipped with a 3D laser head that can handle complex processing, it also contributes to the expansion of product variations through tapping. Additionally, the automatic focal position adjustment function calculates the optimal focal position, enabling high-precision and quick processing of complex shapes. 【Features】 ■ Achieves laser processing at high speed and optimal conditions ■ Tapping processing is also possible (maximum tap M12) ■ High-precision integrated processing from laser processing to tapping ■ Reduces material waste with optimal processing programs tailored to material shapes ■ Streamlines handling by processing a series of operations in one go, ensuring speed *For more details, please download the PDF or feel free to contact us.

  • Processing Contract

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UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

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  • Other processing machines

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CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

Comfortable operability with in-house developed CNC! CO2 laser processing machine.

The "CO2 Laser Processing Machine" achieves low power consumption through a design that eliminates waste. It supports various surface treatments such as blackening, browning, and untreated, as well as various processing methods like DLD and Conformal Mask. It offers comfortable operability with our in-house developed CNC. 【Features】 ■ Achieves low power consumption through a design that eliminates waste ■ Supports various surface treatments (blackening, browning, untreated) ■ Supports various processing methods (DLD, Conformal Mask, Resin Direct) ■ Comfortable operability with our in-house developed CNC ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Exhibition of CO2 and UV laser processing technology, hole drilling and contour processing machines, fully automatic AOI, and X-ray inspection equipment.

The Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.

  • 穴明機写真vr2.jpg
  • 全自動AOIvr2.jpg
  • CM-800vr2.jpg
  • Exhibition planning/construction

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Introduction to examples of inner layer copper foil machining.

Introduction to examples of inner layer copper foil machining.

【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

  • Circuit board processing machine

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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

  • Processing Contract

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Laser processing machine - multipurpose single-axis laser processing machine

Laser processing machine - multipurpose single-axis laser processing machine

Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

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  • Other processing machines

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CO2 Laser Processing Example: Package Substrate Processing

CO2 Laser Processing Example: Package Substrate Processing

Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct TH Processing

CO2 Laser Processing Example_Cu Direct TH Processing

Cu Direct Double-Sided Through Hole Processing

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct BH Processing

CO2 Laser Processing Example_Cu Direct BH Processing

Cu Direct Blind Processing Examples

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

  • Processing Contract

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UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

Case study of UV and CO2 laser hybrid processing of Cu+PP materials

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

  • Processing Contract

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UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

UV Laser Processing Examples: SI Wafers, Ceramics, Glass, etc.

Examples of UV laser processing applications for various materials.

Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.

  • Processing Contract

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UV Laser Processing Example: Package Substrate

UV Laser Processing Example: Package Substrate

Examples of micro-diameter hole processing for package substrates

Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.

  • Processing Contract

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