Glass High-Speed Crackless Cutting Device "GLASS LASER HS"
Processing cracks below 10μm! Special equipment for high-speed crack-free cutting of glass.
The laser system "GLASS LASER HS" is a dedicated device for high-speed crackless cutting of glass. The processing area is a maximum of 2650mm x 750mm, and the processing speed is high at 500mm/s, with the outer shape cutting of a 4-inch panel taking only 5 seconds. The processing cracks are also below 10μm. 【Features】 ■ Processing area: 2650x750mm ■ High-quality processing ■ High-speed cutting ■ High-speed crackless cutting For more details, please refer to the catalog or feel free to contact us.
- Company:デルファイレーザージャパン
- Price:Other