No need for pilot holes! Dissimilar metal bonding for electronics | Multi-material
Contributing to heat dissipation! Multi-materials enabling dissimilar metal bonding.
In the electronics industry, as performance increases, the heat dissipation of components has become an important issue. In particular, effective heat dissipation design is required by combining high thermal conductivity aluminum with strong steel plates. However, the joining of dissimilar metals complicates processes such as drilling and welding, which can lead to increased costs and reduced design flexibility. Our "Multi-Material" solution achieves the joining of dissimilar metals without the need for drilling and with only one-sided construction, addressing these challenges. 【Application Scenarios】 - Joining heat dissipation plates and enclosures - Joining heat sinks and substrates - Combining high thermal conductivity materials 【Benefits of Implementation】 - Increased design flexibility for heat dissipation - Weight reduction through fewer components - Cost reduction through fewer processes
- Company：新城製作所
- Price：Other
