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Precision Polishing Machine Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. ムサシノ電子 Tokyo//Industrial Machinery
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. null/null
  4. 4 パルメソ Niigata//Testing, Analysis and Measurement
  5. 4 シーケービー Tokyo//Trading company/Wholesale

Precision Polishing Machine Product ranking

Last Updated: Aggregation Period:Sep 10, 2025~Oct 07, 2025
This ranking is based on the number of page views on our site.

  1. "Pre-processing machine for research and development" Ultra-precision polishing device 'PERET' パルメソ
  2. OTEC / Precision Polishing Device "Drag Finish Machine" シーケービー
  3. Precision Grinding Device "MA-200e" ムサシノ電子
  4. Precision Grinding Device "MA-200" ムサシノ電子
  5. Tabletop Precision Grinding Device "ALP-250 Model" イマハシ製作所 東京営業所

Precision Polishing Machine Product List

16~30 item / All 31 items

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Vertical Single-Sided Precision Grinding Machine SW-300

There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!

Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.

  • Special Processing Machinery

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"Pre-processing machine for research and development" Ultra-precision polishing device 'PERET'

A precision grinding device that even beginners can easily use! Difficult high-precision pre-processing can be done by anyone! Ultra-low angle diagonal grinding and relief grinding that make deep grinding possible!

"PERET" is a polishing device for pre-analysis treatment during sample preparation, developed from MSE technology, aimed at observation and analysis. Our new product "PERET" addresses the following concerns: "I want to perform polishing more precisely and see cross-sections at a 1μ scale." "I want to conduct advanced analysis with the microscope I have." It is designed to solve the problems faced by customers in research and development departments and product analysis. With angled polishing, it enables depth-direction observation and analysis using SEM or XPS over a wide area from a single polished surface. Additionally, relief polishing allows for precise observation and analysis of defects and material distribution within a large area of the polished surface. 【Features】 ■ Does not cause chemical alteration that occurs from nm-level removal ■ Relief polishing, angled polishing, and polishing without resin alteration ■ High-resolution polishing at 10nm increments ■ Polishing that brings cross-sections to the surface *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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[Column] Episode 1 Part 1 - Everything Started with Meeting IMT -

I'm graduating from hand polishing!

Every day after joining the company, I receive strict guidance on hand polishing from my supervisor. It's difficult to grind parallel, and it takes a whole day to finish just one piece. Colleagues from other departments often ask, "Why is that new employee standing there all day?" It's a bit tough... One day, I searched for sample polishing on Ipros and found IMT, which ranked first in the search results. When I requested information, a cheerful and friendly salesman came to see me right away and offered to help. He introduced me to the IM-P2 and SP-L1, providing detailed explanations. (For uses not listed in the catalog, please inquire.) I convinced my supervisor and got permission to conduct a demo of the IM-P2/SP-L1. [To be continued in the next part]

  • Wafer processing/polishing equipment

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[Column] Episode 1 Part 2 - Everything Started with the Encounter with IMT -

I'm graduating from hand polishing!

I had a worry that I might not be able to polish well. While recalling the days of polishing by hand, I listened to the salesperson's explanation. The result was that a task that used to take a whole day was shortened to about 30 minutes. The parallelism was also well established and satisfactory. I thought I could catch up to the senior's skilled techniques with this. With the polishing time reduced to one day, I was able to do other tasks, making work a bit more enjoyable. The seniors also started using it, and one machine was no longer enough. Overtime has decreased, and my private time has increased. In a fleeting moment, I think about wanting to meet that salesperson from IMT... And then the next challenge arises... 【To be continued】

  • Wafer processing/polishing equipment

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[Column] Episode 2 Part 2 - Solve the Drainage Problem -

~Me, Kenma, and IMT~

When we requested to borrow the demo unit, it was popular, and we had to wait for a rental reservation... Finally, it was our turn! The device looks a bit like a face, which is kind of cute lol. When we actually used it, the water that was supposed to be dirty from polishing became very clean. He said, "Even if you spray circulating water on a 1μm polishing cloth, it won't get scratched." I was skeptical, but when I tried it, it really didn't get scratched. I created a proposal incorporating SDGs. Since it was necessary to consider the environment, it was quickly approved and ordered— Even during delivery, he explained everything diligently, which was reassuring. I want to see him... 【To be continued】 -Manual embedding machine breaks-

  • Wafer processing/polishing equipment

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[Case Study Presentation!] Sanxin's Film Polishing Technology - Case Studies for Solving Problems

We want to reduce the man-hours for grinding! We will design according to your needs, such as wanting to use a different type of polishing instead of whetstone grinding! We are currently offering a collection of case studies that solve problems!

Sanshin Co., Ltd. is a manufacturer that designs and manufactures tape polishing machines based on technology, experience, and years of proven results, tailored to your needs. "The Collection of Case Studies on Sanshin's Film Polishing Technology" is a compilation of case studies on the film polishing technology handled by Sanshin Co., Ltd. It covers the basics of film polishing, the characteristics of Sanshin films, and the Sanshin technology that meets a wide variety of needs. We also introduce case studies from medical device manufacturers, automotive parts manufacturers, and electronic device manufacturers. ■ There is dirt after the final process, and strong cleaning agents cannot be used, making it impossible to remove the dirt... ■ We want to improve the roughness of the ball screw groove to reduce noise and enhance rolling performance. ■ We want to remove burrs that appear when making small holes in flat plates. Sanshin can solve these problems! 【Featured Case Studies】 ■ Medical Device Manufacturer - Proposed an outer diameter polishing device. ■ Automotive Parts Manufacturer - Proposed an inner diameter polishing device. - Proposed a ball screw polishing device. ■ Electronic Device Manufacturer - Proposed a flat surface polishing device. *We are currently accepting sample tests! For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other abrasives

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Precision Grinding Device Attachment Exchange Type 'KIDF-2065-100'

It is possible to perform grinding on corner R surfaces and tapered sections. It also supports inner diameter grinding through attachment replacement.

The 『KIDF-2065-100』 is a state-of-the-art attachment exchangeable polishing device that applies tape polishing technology and accommodates a wide variety of workpiece shapes. Equipped with a rotating mechanism for the polishing head, it can perform polishing not only on the outer surface of cylindrical objects but also on corner R surfaces and tapered sections. Additionally, internal diameter polishing has become possible through the exchange of attachments. 【Features】 ■ The polishing head can be pressed against the workpiece at an angle suitable for the polishing surface. ■ By exchanging the attachments, internal diameter polishing is possible for diameters ranging from φ20 to 65mm and depths up to 100mm. ■ The polishing head can be swung up to 90°, allowing for polishing up to the edge. ■ Environmentally friendly polishing processes are possible. ■ Selection of polishing films suitable for the material of the workpiece can be made. ★ Test processing is always welcome! Please feel free to contact us if you are interested. * For more details, please refer to the PDF materials. Inquiries are also welcome.

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  • イプロス研磨機写真?.jpg
  • イプロス研磨機写真?.jpg
  • Wafer processing/polishing equipment

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[Polishing Example] Precision polishing to prevent cracks and fissures in the inner diameter of holes.

There is a possibility of cracks occurring from burrs and fine scratches on the inner diameter of holes machined into the workpiece, and this is an example of prevention through precision grinding. *Example gift!

Are there any cracks that occur from burrs or fine scratches on the inner diameter of holes cut into the workpiece? This is an introduction to a case study on precision grinding that prevents cracks from such cut holes. When holes are drilled through cutting, there is a possibility of cracks occurring from burrs or fine scratches. By precision grinding the inner diameter of the hole, scratches can be eliminated, preventing cracks. *For more details, please contact us directly. *Please view the PDF of the case studies available for download.

  • Processing Contract
  • Hand polishing and filing
  • Wafer processing/polishing equipment

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Musashino Electronics Co., Ltd. General Catalog

High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.

This catalog features products handled by Musashino Electronics Co., Ltd., such as "ultra-precision grinding machines" and "experimental precision scribers." Our grinding machines possess high flatness accuracy on the rotating reference plate due to their structural characteristics, guaranteeing flatness of 5μm or less. In addition to a diverse range of grinding machines, we also introduce various "automatic grinding (sample holding) units" and "flatness correction tools" that respond to the diversifying applications. [Featured Products] ■ Ultra-precision grinding machines ■ Automatic grinding (sample holding) units ■ Flatness correction tools and various auxiliary devices ■ Various sample holders ■ Grinding discs *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-200"

There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!

The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-150"

Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.

The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • CMP Equipment
  • Other processing machines

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Tabletop Precision Grinding Device

This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.

We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)

  • CMP Equipment

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Precision Grinding Device MA Series

Reproducibility in sample grinding

By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.

  • Wafer processing/polishing equipment

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Fully equipped with large machinery! Crystal Optical Co., Ltd. List of machinery and measurement equipment.

This is a list of machine equipment and measurement devices for crystal optics used in ultra-precision polishing that supports advanced technology.

Crystal Optics is based on the polishing technology of optical single crystals and has developed ultra-precision polishing across a wide range of applications, including optical communications, metals, ceramics, and other new materials, through the application of crystal polishing techniques. Additionally, we conduct integrated production from upstream (ultra-precision grinding, ultra-precision polishing) to downstream (materials, machining) with just one drawing. [Integrated Production] Cutting, grinding, polishing, ultra-precision processing, surface treatment (electropolishing/passivation treatment), and measurement. ☆ We guarantee high-precision processing with a wide variety of measuring instruments. The polishing targets of Crystal Optics are diverse, covering many advanced fields of various industries, and our customers are characterized by being spread across the entire country. [Main Fields] Semiconductors, LCDs, films, batteries, machine tools, aircraft, measuring instruments, optics, medical, communications. We would like to introduce the main equipment of Crystal Optics, including polishing machines, grinding machines, machining centers, precision CNC lathes, other processing machines, cutting and forming equipment, cleaning equipment, ancillary facilities, and major precision measuring instruments. ◎ For more details, please contact us or refer to our catalog.

  • Other processing machines

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