Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.
16～27 item / All 27 items
There is no common issue of "flatness deviation of the reference plate" found in grinding machine manufacturers, and the workpiece can always be ensured to be flat without the need for flat grinding technology, making it easy for anyone to secure flatness!
Brittle material substrates (such as sapphire, SiC, GaN, etc.) can be easily polished to a high precision flat surface in a short time.
There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!
The "MA-200" is a precision polishing device that offers high accuracy and is suitable for sample preparation in research and development. By using polishing discs and abrasives tailored to the samples, better polished surfaces can be achieved, with polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less. It is also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN. 【Features】 ■ High accuracy, suitable for sample preparation in research and development ■ Better polished surfaces can be achieved by using polishing discs and abrasives tailored to the samples ■ Polishing accuracy of flatness λ/10 or less and surface roughness of 0.01μm or less ■ No edge rounding and no detachment of inclusions, making it suitable for evaluation with EPMA and similar techniques ■ Also suitable for polishing cross-sections of ICs, inclined polishing, and end faces of optical crystals such as LN *For more details, please refer to the PDF document or feel free to contact us.
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
The "MA-150" is a personal-type polishing machine designed to be installed next to SEM, EPMA, TEM, etc., allowing one machine to be used for one specific purpose. Its compact size does not take up much space, making it suitable for polishing small samples, and it can polish materials such as semiconductor wafers, sapphire, SiC, glass, and ceramics. By using polishing discs and abrasives tailored to the sample, better polished surfaces can be achieved. 【Features】 ■ Personal-type polishing machine ■ Designed and developed to allow one machine to be used for one specific purpose ■ Better polished surfaces can be obtained by using polishing discs and abrasives suited to the sample ■ Compact size does not occupy much space, making it ideal for polishing small samples ■ Capable of polishing semiconductor wafers, sapphire, SiC, glass, ceramics, etc. *For more details, please refer to the PDF document or feel free to contact us.
This one machine handles everything from wrapping (rough polishing) to polishing, and is capable of precision polishing of compound semiconductors such as GaAs and InP.
We support everything from lapping (coarse polishing) to polishing, and we monitor and automatically correct the surface shape of the lapping plate itself with a resolution of 0.1μm. The polishing tool communicates with the main unit, allowing for chart displays of the polishing rate, setting of target polishing amounts, and configuration of multi-recipes. Additionally, we offer chemical models compatible with CMP for compound semiconductors such as GaAs and InP, enabling high-precision, high-speed, and damage-free CMP all with a single machine. (De-layering is also possible.)
Reproducibility in sample grinding
By selecting a suitable sample holder for the sample, various shapes and processing purposes for polishing can be achieved. This is a tabletop precision polishing device that is optimal for sample preparation for TEM and SEM observation. Additionally, by replacing the polishing disc and polishing agents, it can handle everything from rough polishing to mirror finishing and CMP (Chemical Mechanical Polishing) with just one unit. 【Examples of materials with processing achievements】 - Semiconductor materials: Si / SiC / GaN / GaAs / InP / Ga2O3 … - Optical materials: Glass / Sapphire / CLBO / YiG / GGG … - Ceramic materials: Alumina / Silicon Nitride … Furthermore, we have numerous achievements with other materials such as metals, minerals, and biological samples.
