Printed Circuit Board for Mobile Devices (Build-Up Specification Module Board)
A circuit board for packages that can accommodate multiple chip components!
The "Printed Circuit Board for Mobile Devices (Build-Up Specification Module Board)" is a product handled by Shinko Seisakusho Co., Ltd., which develops, designs, manufactures, and sells electronic circuit boards. This product features a build-up specification using laser vias, incorporating prepreg in the build-up layers to achieve rigidity, dimensional stability, and insulation reliability in thin boards. Additionally, filled vias allow for random placement of vias and via stack structures, enhancing design flexibility. The vias are filled with metallic copper, improving heat dissipation characteristics. 【Features】 ■ A board suitable for packages that can accommodate multiple chip components ■ Designed for mobile devices ■ Two types of conductivity options for laser vias (conformal vias and filled vias) ■ Improved heat dissipation characteristics due to copper filling in the vias *For more details, please refer to the catalog or feel free to contact us.
- Company:伸光製作所
- Price:Other