We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Printed circuit board mounting.
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Printed circuit board mounting Product List and Ranking from 75 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

Printed circuit board mounting Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. 鳥取スター電機グループ 技術企画課(鳥取コスモサイエンス内) Tottori//Consumer Electronics
  2. TOPBAND JAPAN Aichi//Other manufacturing
  3. 須賀川市 経済環境部商工課 Fukushima//Government
  4. 4 京写 Kyoto//Consumer Electronics
  5. 5 ヨーホー電子 Osaka//Building materials, supplies and fixtures

Printed circuit board mounting Product ranking

Last Updated: Aggregation Period:Dec 24, 2025~Jan 20, 2026
This ranking is based on the number of page views on our site.

  1. Tottori Cosmo Science Co., Ltd. Business Introduction 鳥取スター電機グループ 技術企画課(鳥取コスモサイエンス内)
  2. TOPBAND JAPAN Co., Ltd. Company Introduction TOPBAND JAPAN
  3. YSE Fukushima Co., Ltd. 須賀川市 経済環境部商工課
  4. 4 EMS (One-stop service for implementation and assembly) [KYOSHA +1] 京写
  5. 5 Reasons for High Quality and Short Delivery Time of Printed Circuit Boards キョウデン

Printed circuit board mounting Product List

91~94 item / All 94 items

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We will respond with lower prices and shorter lead times than other companies!

We have over 10,000 types of components! From large-sized L dimension boards to the manufacturing of water-related (waterproof/drip-proof/dust-proof) product boards, we can accommodate your needs.

Introducing Hox Co., Ltd., aiming for the pinnacle of EMS, with a focus on high quality and high reliability. ■ Purchasing Power of Components ⇒ Our company holds over 10,000 types of components. ⇒ We can procure at low cost and with short delivery times through unique domestic and international routes. ■ Design and Technical Capability ⇒ We are capable of hardware and software (firmware and applications) development and design, inspection machines, mechatronics applications, sheet metal enclosures, and plastic molded products. ■ Production Technology Capability ⇒ We provide total support from the design and manufacturing of manufacturing adjustment and inspection equipment to the startup of the equipment. ■ PCB Mounting Capability ⇒ Large PCBs: We can handle L-size boards up to 510mm x 460mm. ⇒ High-density multilayer boards: Achievements include a maximum of 60 layers and a maximum board thickness of 6.3mm. ⇒ We have extensive experience in high-density multilayer boards, aluminum boards, high-difficulty boards, and the mounting of prototype components. We have received high praise, especially for the production of large boards and BGA mounting and rework tasks. ■ Special Processing Manufacturing Capability ⇒ We have abundant experience in special processing coatings and urethane resin potting performed after the assembly of printed circuit boards and electronic devices. *Please refer to the PDF download for an introduction to our manufacturing equipment and product samples.

  • Visual Inspection Equipment
  • Soldering Equipment
  • Other inspection equipment and devices

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Face's Wisdom Bag: "Emergency Response Case Studies in Prototyping"

In the case of prototyping printed circuit boards, there may be instances where patterns are cut and jumper wiring is performed to modify the circuit.

Below are the basic jumper wiring procedures. *For more details, please refer to the PDF document or feel free to contact us.

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Puriken Co., Ltd. Printed Circuit Board Assembly

Align the mounting surface of components that cannot be reflowed twice! Heavy components will be placed on the back side of the assembly.

We would like to introduce "implementation," which is a key point in our design. Since the temperature behind tall components tends to rise less, we consider the flow direction of reflow when arranging components. If it leads to mass production, we will adjust the pad dimensions, shapes, and mounting pitch to match the specifications of the mass production factory. 【Features】 ■ Align the mounting surface of components that cannot undergo double reflow Heavier components are placed on the back side of the mounting ■ Arrange components considering the flow direction of reflow ■ Match the thermal capacity of the land on both sides of chip components as much as possible ■ Consider the space for soldering iron for hand-placed components *For more details, please feel free to contact us.

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