Thermal print head
We provide thermal print heads suitable for realizing your printing needs!
Our "Thermal Print Head" supports both face-down bonding method, which combines high reliability and high productivity with a drive IC mounting method, and wire bonding method, which enhances design flexibility. We can flexibly customize to meet various requests. Thanks to our in-house integrated production system, we can adapt to various applications by selecting from a wide range of glaze shapes, resistance values, and types of protective films. 【Features】 ■ Supports face-down bonding method and wire bonding method ■ In-house integrated production system from the core material, ceramic substrate, to the completed head ■ Adaptable to various applications through a wide selection of glaze shapes, resistance values, and types of protective films ■ The head shape can also accommodate flat types, edge types, corner edge types, and peripheral component mounting such as brackets according to requests *For more details, please refer to the related links or feel free to contact us.
- Company：京セラ プリンティングデバイス事業本部
- Price：Other
