IH Reflow
Dramatically reducing CO2 emissions in the electronic circuit board production process! Electromagnetic induction heating has been used for electronic components.
"IH Reflow" is a mounting technology that applies IH (induction heating) to instantaneously and damage-free mount only the necessary parts without physical stress. It achieves 100% yield for non-contact mounting at specific locations without damage in an instant. It enables the mounting of electronic components on low-heat-resistant substrates such as inexpensive and flexible/stretchable PET, fabric, and paper. Additionally, it makes solder mounting on high-heat-dissipating substrates like glass and power boards easier. 【Features】 ■ Electromagnetic induction ■ Non-contact ■ Instant heating ■ Spot heating ■ Low-heat-resistant / high-heat-dissipating substrates *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：BuhinDana
- 価格：Other
