Substrate Cleaning Agent - List of Manufacturers, Suppliers, Companies and Products

Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

Company：ゼストロンジャパン
Price：Other

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

Company：ゼストロンジャパン
Price：Other

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Substrate Cleaning Agent - List of Manufacturers, Suppliers, Companies and Products

Substrate Cleaning Agent Product List

Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

Effects of morphological changes in flux residues after soldering on cleanability.

Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research