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Tape Mounter Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Tape Mounter Product List

1～9 item / All 9 items

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Dicing Tape Mount (Semi-Automatic Type)

Dicing Tape Mount (Semi-Automatic Type)

A device for semi-automatically applying dicing tape to silicon wafers. It is a semi-auto type compatible with 12-inch wafers, providing supply of wafer frames and frame mounting.

● Maximum workpiece: 200-300mm ● Cycle time: 13 seconds per cycle ● Pressurization method: Air cylinder pressurization ● Cutting method: Automatic circular blade cutting ● Machine dimensions: W880×D720×H650mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 3A ● Weight: 120kg

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Semi-Automatic Tape Mounter

Semi-Automatic Tape Mounter

Cost reduction and quality improvement with pre-cut tape compatibility!

● Industry's smallest Compact space-saving design that doesn't require a specific placement. ● Industry's fastest Achieves a sticking speed of 25 seconds per sheet. ● Compatible with pre-cut tape Waste tape width is reduced to 1/4 of the conventional size! Significant cost savings can be achieved. ● One-touch operation Quickly and neatly affixes using only the work set.

  • Mounter
  • Other semiconductor manufacturing equipment

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Full Auto Vacuum Tape Mounter

Full Auto Vacuum Tape Mounter

Achieve high-quality mounting at low cost! Fully automatic vacuum tape mounter.

This machine is a "Fully Automatic Vacuum Tape Mounting System" that can attach wafers inside a vacuum chamber. It comes standard with OKK's unique pre-cut unit, allowing for easy and high-quality attachment at low running costs simply by setting the dicing frame and wafer. 【Features】 ■ Non-contact attachment (patented) with no damage ■ Waste width "0" (patented) ■ Abundant options *For more details, please download the PDF or feel free to contact us.

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  • Other processing machines

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Vacuum Film Application Device | LP Tape Mounting Machine

Vacuum Film Application Device | LP Tape Mounting Machine

Introduction of the vacuum film application device! It solves the problem of damage caused by rollers.

The "Vacuum Mounter" is a vacuum film application device designed for workpieces that should not be subjected to stress. It solves the problem of damage caused by rollers. By applying with vacuum, bubbles do not enter the workpiece, and the application conditions (vacuum level, pressure) can be adjusted. Please consult us for a demo test. 【Features】 ■ Compatible with workpieces that should not be subjected to stress ■ Solves the problem of damage caused by rollers ■ No bubbles enter the workpiece ■ Application conditions can be adjusted *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Mounter

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Dicing tape mount

Dicing tape mount

This laminator supports wafers from 4 inches to 8 inches, has a compact design that can be placed on a tabletop, and is easy to operate even for beginners.

● Maximum workpiece: 150-200mm ● Film width: 270mm ● Table temperature: Room temperature to 60℃ ● Cutting method: Manual round blade cut ● Machine dimensions: W430×D830×H250mm ● Air source: Dry air 0.5Mpa ● Power supply: AC/100V 1A ● Weight: 20kg

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Manual tape mountaineer

Manual tape mountaineer

Manual tape mounter is a tape application machine that combines a wafer mounter and a wafer laminator.

The manual tape mount is a manual type of mount that attaches various tapes, such as dicing tape and BG (back grind) tape, to frames and workpieces. With a calculated table design, it minimizes the waste width of the tape to the utmost limit, while also considering running costs in its design.

  • Mounter
  • Other semiconductor manufacturing equipment

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[Technical Information] Tips for Uniform Tape Application on Wafers

[Technical Information] Tips for Uniform Tape Application on Wafers

Introduction to the tape application process in the dicing process.

The "Tape Mount Handbook" is a technical document from Techno Vision, which develops and sells semiconductor manufacturing equipment, cleaning equipment, and post-process assembly equipment. This document includes an overview of the "Tape Application Process in the Dicing Process," as well as solutions to issues and details about the equipment. [Contents (partial)] ■ Overview ■ Tape Application ■ In the case of manual application ■ If you are already using a tape mount ■ Techno Vision manufactured mount *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Mounter

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Manual Pre-Cut Tape Mounting Machine PFM-9008

Manual Pre-Cut Tape Mounting Machine PFM-9008

Manual wafer mount for pre-cut tape.

The PFM-9008 is a manual wafer mount for pre-cut tape. While expensive specialized equipment was previously required for applying pre-cut tape, this can now be done with a simple manual machine. It is ideal for R&D and small quantity applications.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Mounter

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Semi-Automatic Tape Mounter 'SMM-100'

Semi-Automatic Tape Mounter 'SMM-100'

Introducing the ERS dicing peripheral equipment that can attach wafers to tape without bubbles.

The "SMM-100" is a semi-automatic tape mounter that accurately adheres wafers and dicing tape to a tape frame. The table can be heated to ensure the appropriate temperature is applied to the wafer. It is equipped with an ionizer to prevent tape static. Additionally, as an option, rings other than the specified tape frame can be accommodated by exchanging the set plate. 【Features】 ■ The table can be heated to ensure the appropriate temperature is applied to the wafer. ■ Equipped with an ionizer to prevent tape static. ■ The application of tape and wafers is performed automatically at the set speed. ■ The thickness adjustment of the wafer can be set by raising or lowering the table height. ■ Bonding of IC substrates (fully molded) is also possible. *For detailed information or product catalogs, please access the related link.

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