Ultrasonic Testing Device "HYPER SCAN IV"
Improved processing speed with multi-channeling! It demonstrates excellent effectiveness in internal defect inspection and delamination inspection, among others.
The "HYPER SCAN IV" is an ultrasonic flaw detection device equipped with offline image processing capabilities, allowing for automatic judgment functions and multi-channel acceleration. It also features a full waveform acquisition function, enabling waveform redrawing with just a gate change, significantly improving work efficiency. The use of a manual joystick enhances operability. Additionally, the inspection area is 350mm x 350mm, with a minimum inspection pitch of 20μm. It demonstrates excellent effectiveness in inspecting internal defects in mass-produced parts and in checking for delamination in soldered joints. 【Features】 ■ Multi-channel specifications (2CH, 4CH) ■ Full waveform acquisition function allows for redrawing with only gate changes ■ Includes a manual joystick for operation ■ Inspection area: 350mm x 350mm ■ Minimum pitch: 20μm *For more details, please refer to the PDF document or feel free to contact us.
- Company:ダイヤ電子応用
- Price:Other