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Ultrasonic cutting machine Product List and Ranking from 4 Manufacturers, Suppliers and Companies | IPROS GMS

Ultrasonic cutting machine Product List

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Plastic Automatic Ultrasonic Cutting Device

Ultrasonic automatic cutting device ideal for cutting plastic gate cuts and burr removal, as well as cutting non-woven fabrics and films.

A cutting device that significantly enhances the cutting operation by fixing a dedicated blade to an ultrasonic vibrating body that vibrates 20,000 to 40,000 times per second and causes the blade to vibrate finely. 【Features】 - By applying the ultrasonic vibrating blade to plastic, the resin heats up at the molecular level, allowing for smooth melting and cutting. - The finely vibrating blade of the ultrasonic cutter reduces the cutting load, enabling precise cutting of hard resins, films, and soft materials or rubber products without distorting their shape and without the workpiece sticking to the blade. - Ultrasonic frequency types of 20 kHz and 40 kHz. - Workpiece rotating cutting mechanism. - Two-axis servo drive control. - Cutting accuracy of ±0.1 mm. - Automatic suction mechanism for cutting debris. - Touch screen operation panel. *For more details, please contact us.

  • Plastic processing machines (cutting and rolling)
  • Ultrasonic cutting machine

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Ultrasonic Cutting Machine 'MC-2020T/MC-2020CRR'

With the specified cutting dimensions, square cakes can be cut into various sizes! The blade can also be cleaned automatically.

The "MC-2020T/MC-2020CRR" is an ultrasonic cutting machine that can cut square, round, and roll cakes with simple operation using just one machine. By utilizing ultrasonic vibrations at a rate of 20,000 times per second to cut the cake, it produces clean cross-sections. Additionally, it can automatically clean the blade (MC-2020CRR). Furthermore, the ultrasonic blade minimizes friction between the food materials and the cutting machine, enhancing productivity and enabling fast, efficient, and effective cutting. 【Features】 ■ Can cut square, round, and roll cakes with simple operation using just one machine ■ Capable of cutting round cakes in various sizes (6, 8, 10, 12 cuts) ■ Can cut square cakes into various sizes by specifying cutting dimensions ■ Utilizes ultrasonic vibrations at a rate of 20,000 times per second to cut cakes, resulting in clean cross-sections *For more details, please refer to the PDF document or feel free to contact us.

  • Food Cutting Equipment
  • Ultrasonic cutting machine

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Takeda Industrial's ultrasonic cutting device 'CSX501'

Equipped with fully automatic and enhanced device functions, as well as remote monitoring capabilities! Contributing to increased productivity in the dicing process!

The "CSX501" is an ultrasonic cutting device equipped with a dual-end support mechanism that enables high-speed cutting, enhancing productivity and adding new functionalities. With the addition of equipment monitoring capabilities, it is now possible to recover from unexpected troubles with minimal equipment downtime through remote support. ■Features - Achieves high-speed, high-quality cutting of a wide range of materials, from difficult-to-cut materials like SiC, alumina, and PZT to composites such as glass and resin! - By adding ultrasound to blade cutting, it significantly reduces blade wear! - The development of a unique spindle and special ultrasonic blade that maximizes ultrasonic effects enables mass production-level cutting of SiC wafers at an 80µm street! *Demo units are available for sample evaluation. *We can also propose the semi-auto type "CSX-400." *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Ultrasonic cutting machine

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Star Techno | Are you efficiently processing various industrial sheets by cutting?

The "XY Table Cutter" suitable for multi-variety, small-lot production cuts materials like resin and carbon using ultrasonic cutting! *Sample cutting available.

As diverse needs continue to expand, there has been a growing demand for cutting processes using different types of material sheets, as well as the need to cut sheets of varying thicknesses and hardness, leading to an increase in multi-variety production. Do you have any of these concerns? ■ Changing molds for punching processes is cumbersome ■ Want to cut plastics, carbon (CFRP), rubber, leather, etc., with a single machine ■ Want to improve yield ■ Want to cut composite materials! And more... Star Tech's ultrasonic cutting machine, the 'X-Y Table Cutter,' can smoothly cut hard materials that were previously impossible to cut with its high-output 500W ultrasonic power. Additionally, it generates almost no cutting debris, allowing for clean cutting of materials. ★ For more details, please check our catalog or product list on our website. ★ We can also accommodate sample cuts at our factory. Please feel free to contact us.

  • cutter
  • Ultrasonic cutting machine

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Takeda Industrial's ultrasonic cutting device 'CSX-400 Series'

Achieving high-quality and high-efficiency cutting of various materials, from difficult-to-cut materials like SiC and LTCC to composite materials such as glass and resin!

The "CSX-400 Series" is an ultrasonic cutting device that cuts a wide range of materials, including difficult-to-cut materials and composites such as SiC, LTCC, glass, and resin, with high quality, achieving high productivity and cost performance through improved blade life. ■ Features - Achieves high-quality and quick cutting thanks to ultrasonic effects! - Easy operation for anyone with a user-friendly interface! - Various cutting methods available, including pitch-cut and staggered-cut! - Reduced processing time with auto-alignment! (60% reduction compared to Takada Industrial) - Reduced daily maintenance time with a large front door! - Options for semi-auto (CSX-400) and full-auto (CSX-401)! - Standard equipped with a cleaning unit (CSX-401)! * For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Ultrasonic cutting machine

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Ultrasonic cutting device for cross-sectional observation 'CSX-100Lab'

By performing "cutting" and "polishing" in one process, we achieve a significant reduction in cross-section cutting work time and high-quality cuts! It can be easily operated by anyone without any skills!

The Takeda Industrial's 'CSX-100Lab' is an automatic cutting device specifically designed for the preparation of cross-sectional observation samples. It significantly reduces the time required to prepare cross-sectional observation samples for both development and mass production, achieving improved operational efficiency and high-quality sample cross-sections! ■ Features - The cutting surface has a beautiful mirror finish due to ultrasonic effects. - Capable of cutting composite materials with varying hardness, including solder and ceramics. - The blade extension can be up to 10mm, accommodating thick samples. - Even beginners can obtain cross-sectional samples for observation without any skill. - After setting the cutting conditions, it operates automatically, allowing for effective use of time. - When combined with the skeleton cut (optional), it can target and cut inside molded electronic components. - There are many successful implementations as a preprocessing device (reducing milling time) such as ion milling. * A demo unit is available, so sample evaluation is possible. * For more details, please refer to the PDF document or feel free to contact us.

  • 断面観察用超音波カッティング装置CSX-100Lab 切断面サンプル.jpg
  • Wafer processing/polishing equipment
  • Other semiconductor manufacturing equipment
  • Ultrasonic cutting machine

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