Repairable Underfill
Due to its excellent repairability, the underfill material adhered to the substrate can be easily removed. There is no risk of damaging the fine wiring on the substrate.
The urethane-based underfill resin 991 series is designed not only for the analysis of defective IC chips but also with the regeneration of high-value-added substrates in mind. The underfill material (residue) adhered to substrates can be easily removed with a solvent (N-methylpyrrolidone is recommended), making the leveling process simple. There is no risk of damaging the fine wiring of PCBs due to high thermal processing.
