Contract Processing: Examples of Hole Drilling with Laser
Introducing fine and precise hole drilling processing using lasers.
The new ultra-short pulse laser processing machine enables processing with minimal thermal impact. We would like to introduce some cutting processing examples as samples from our application cases. We will respond to customer requests regarding processing methods and more. 【Drilling Processing Examples (Sample)】 ■ Drilling of Polyimide Material - Equipment Used: TEA-CO2 Laser - Material: Polyimide - Hole Diameter: φ0.2 / Plate Thickness: 0.125m / Magnification: ×350 ■ Cross-section of Polyimide Drilling Processing - Equipment Used: TEA-CO2 Laser - Material: Polyimide - Hole Diameter: φ0.2 / Plate Thickness: 0.125mm / Magnification: ×350, etc. *For more details, please refer to the PDF document or feel free to contact us. Alternatively, visit our website at https://www.ebtohoku.co.jp/
- Company:東成イービー東北
- Price:Other