![[Materials and Defect Analysis] X-ray Microfocus Inspection: X-ray CT Imaging](https://image.mono.ipros.com/public/product/image/3c4/2000713350/IPROS14133586045300719843.png?w=280&h=280)
[Materials and Defect Analysis] X-ray Microfocus Inspection: X-ray CT Imaging
Pixel resolution is approximately 7 to 120 µm! Measuring voids in aluminum die-cast products and solder.
Our company conducts "X-ray Microfocus Inspection: X-ray CT Imaging." X-rays are irradiated onto the sample, which is rotated 360 degrees on the sample stage for imaging. This non-destructive method allows for the three-dimensional observation of a wide range of products, including the internal structure and defects of the sample. Due to the varying penetrability of X-rays, contrast is created based on the constituent elements (density). Elements with higher density appear bright, while those with lower density appear dark. 【Features】 - Target sample size: Diameter 150 × Height 170 mm (for vertical imaging) and up to 5 kg - X-rays are irradiated onto the sample, which is rotated 360 degrees on the sample stage for imaging - Enables three-dimensional observation of a wide range of products, including the internal structure and defects of the sample - Contrast is created based on the constituent elements (density) due to the varying penetrability of X-rays - Elements with higher density appear bright, while those with lower density appear dark *For more details, please refer to the related links or feel free to contact us.
- 企業：ミツバ環境ソリューション
- 価格：Other
