Wire diamond saw
Cuts quickly with a clean cutting surface. It can cut without applying pressure to the sample. Ideal for wafer cutting.
While adjusting the weight to maintain balance, the diamond-coated loop wire approaches the sample for precision cutting. Maximum sample size: 50.8mmφ (2”). Equipped with a digital micrometer and a two-axis goniometer as standard. It demonstrates its power in cutting samples made of mixed materials with different hardnesses.
- Company:オーリー
- Price:Other