Stage "Porous Adsorption Stage"
Reduce downtime and defect rates caused by chip adhesion errors and bonding mistakes!
The "Porous Adsorption Stage" is a stage that can reduce the operational rate decline due to chip adsorption errors and the defect rate caused by bonding errors. It allows for full adsorption of wafer sheets and can also eliminate warping of the wafer sheets. Furthermore, it resolves foreign matter contamination (plating debris) caused by plating peeling during wafer adsorption. Custom orders can accommodate various materials and shapes. Please feel free to consult us. 【Features】 ■ Reduces pickup errors caused by chip floating and rotation ■ Allows for full adsorption of wafer sheets ■ Capable of eliminating warping of wafer sheets ■ Stabilizes the amount of needle lift *For more details, please refer to the catalog or feel free to contact us.
- Company：タイショー
- Price：Other
