High-precision, low-oxygen clean heat treatment compatible with PLP and large panel processes.
Contributing to the resolution of heat treatment challenges associated with the large panelization of advanced packages!
This document introduces the low-oxygen clean oven "SCO," which supports large panels of 510×515mm and achieves high-precision heat treatment in low-oxygen and clean environments. It explains the main technological elements that support the structure of the device, focusing on their functional significance and structural innovations. Structural diagrams and various data are also included, so please take a moment to read through it. [Contents] ■ High-precision heat treatment for large panels aimed at practical application of PLP (Panel Level Package) ■ Key technologies of the SCO series that support heat treatment quality in advanced packaging fields ■ Unique filters that achieve uniform temperature distribution ■ High sealing performance realized by magnetic fluid seals ■ Particle suppression through thermal expansion countermeasures ■ Improved safety at high temperatures through external water cooling mechanisms *For more details, please download the PDF or feel free to contact us.
- Company：エスペック
- Price：Other
