3次元ICパッケージ×グローバルインフォメーション - List of Manufacturers, Suppliers, Companies and Products

[English Market Research Report] The Global Market for 3D IC Packaging

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3D IC packaging is one of the packaging technologies. It is used in various end-user industries such as consumer electronics, aerospace and defense, medical devices, telecommunications, and automotive. In this method, active chips are integrated through die stacking to achieve the shortest interconnections and the smallest package footprint. It is also possible to mount multiple ICs within the same package. The 3D IC packaging market is expanding due to factors such as the increasing demand for electronic products and the miniaturization of electronic devices.

• Company：グローバルインフォメーション
• Price：500,000 yen-1 million yen

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