3FCCL uses adhesive material 'EPOX-AH357/3501/333'
Mass production is possible! A high-performance adhesive that combines flexibility to contribute to reducing production costs.
"EPOX-AH357/3501/333" is a high-performance adhesive that combines flexibility. It excels in adhesion to polyimide and is used in substrates that require flexibility, such as flexible circuit boards (FCCL). Additionally, due to its characteristics, it can be produced in a roll-to-roll manner, enabling mass production and contributing to cost reduction. 【Features】 ■ High-performance adhesive with flexibility ■ Excellent adhesion to polyimide ■ Used in substrates that require flexibility ■ Capable of roll-to-roll production ■ Contributes to cost reduction *For more details, please refer to the PDF document or feel free to contact us.
- Company：プリンテック
- Price：Other
