Last Updated： Aggregation Period:Aug 19, 2026～Sep 15, 2026
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31～38 item / All 38 items
Robust edge computer equipped with Intel CFL-R S processor, achieving high performance and ample storage expandability.
The 【RCO-6000-CFL-4NH】 features ultra-fast NVMe storage and adopts 2.5-inch U.2 15mm form factor NVMe SSD storage media to support larger capacities. This system is equipped with four lockable and hot-swappable NVMe SSDs that can be configured with RAID options 0, 1, 5, and 10.
Edge AI PC with RTX 2060S mounted on a BOX PC using CFL-R S CPU【RCO-6000-CFL-2N-2060S】
The 【RCO-6000-CFL-2N-2060S】 adds a hot-swappable NVMe SSD canister to the base RCO-6000-CFL, allowing for the installation of up to four lockable 2.5" U.2 NVMe SSDs. Additionally, it features an added PCIe expansion slot equipped with an NVIDIA GeForce RTX 2060 Super GPU for inference acceleration.
Moxa's industrial-grade fanless design! Achieving AIoT computing under extreme conditions.
Moxa's "Edge Computer" features a high-performance Intel Core i processor, wireless connectivity, and a wide operating temperature range. In addition to having an expansion interface that allows for the integration of hardware accelerators such as VPUs, it supports Intel's OpenVINO toolkit for AIoT application development. It has passed rigorous testing, ensuring stable operation over long periods, which is required for industrial AIoT applications. 【Features】 ■ High performance ■ Integrated wireless ■ Robust design ■ Ultra-compact size with abundant I/O ■ Strong security ■ Compliance with industrial standards *For more details, please refer to the PDF document or feel free to contact us.
Utilizing a deep learning acceleration platform equipped with NVIDIA Jetson Orin NX/Orin Nano for edge AI.
【ADLINK DLAP-211-Orin Features】 ■ Dimensions: 148mm wide × 52mm high × 120mm deep, 0.92 liters ■ Fanless NVIDIA Jetson Orin NX/Orin Nano CPU ・DLAP-211-Orin NX 8GB: 6-core Arm Cortex-A78AE v8.2 64-bit CPU, 1.5MB L2 + 4MB L3 ・DLAP-211-Orin NX 16GB: 8-core Arm Cortex-A78AE v8.2 64-bit CPU, 2MB L2 + 4MB L3 ・DLAP-211-Orin Nano 4GB / 8GB: 6-core Arm Cortex-A78AE v8.2 64-bit CPU, 1.5MB L2 + 4MB L3 ■ I/O Connectors: 1 HDMI, 2 GbE, 4 USB3.0, 1 COM
Accelerate AI inference with AGX Orin. An AI platform that can complete everything from development to deployment solely on the edge.
The BOXER-8642AI, which can be widely used for AI development, is capable of simultaneously processing large models and multiple AI tasks thanks to the GPU performance of the AGX Orin and LPDDR5 memory. It comes standard with Jetpack 5.1.1, allowing for immediate use of TensorRT and CUDA. This AI edge PC enables a smooth transition from proof of concept to mass production. Please check the datasheet for detailed specifications.
Arestech, equipped with 13th/12th generation CPU, fanless, extended temperature, AI/machine vision compatible.
【Arestech SE-5012E Features】 ■ Dimensions: 177mm (W) x 228mm (H) x 325mm (D) ■ Weight: 8.8kg ■ Supports 13th/12th generation Intel Core i LGA1700 CPU (up to 35W) ■ Wide temperature range: -40 to 70°C ■ 2x DDR5 SO-DIMM (4800/5600MHz, up to 64GB) ■ 4 display outputs via 3x DisplayPort + 1x VGA (3x HDMI* optional) ■ 2x 2.5GbE LAN ■ 8x USB 3.2 Gen2, 6x RS-232/422/485 ■ Capable of supporting external GPU (such as NVIDIA RTX) ■ Wide power supply: 9-48V DC input ■ Vibration resistance: 3Grms, shock resistance: 30G ■ 1 x Full-Size Mini-PCIe (PCIe, USB 2.0 and SIM), 1 x M.2 B-Key 2242/3042/3052 (PCIe, USB 3.0 and SIM), 1 x M.2 E-Key 2230 (PCIe, CNVi), 1 x PCIe x16 Slot expansion slot support
Arestech, equipped with 13th/12th generation CPU, fanless, extended temperature range, AI/machine vision compatible.
【Arestech SE-5014E Features】 ■ Dimensions: 217mm (W) x 228mm (H) x 325mm (D) ■ Weight: 9.7kg ■ Supports 13th/12th generation Intel Core i LGA1700 CPU (up to 35W) ■ Wide temperature range: -40 to 70°C ■ 2x DDR5 SO-DIMM (4800/5600MHz, up to 64GB) ■ 4-screen output via 3x DisplayPort + 1x VGA (3x HDMI* optional) ■ 8x USB 3.2 Gen2, 6x RS-232/422/485 ■ Capable of mounting external GPU (such as NVIDIA RTX) ■ Wide power supply: 9-48V DC input ■ Vibration resistance: 3Grms, shock resistance: 30G ■ Expansion slots ・1 x Full-Size Mini-PCIe (PCIe, USB 2.0 and SIM) ・1 x M.2 B-Key 2242/3042/3052 (PCIe, USB 3.0 and SIM) ・1 x M.2 E-Key 2230 (PCIe, CNVi) ・1 x PCIe x16 Slot ・2 x PCIe x8 Slot (4-lane)
Railway and vehicle-mounted, equipped with NVIDIA Jetson T5000 module, supports extended temperature and wide power supply, PC for AI embedded systems.
**Vecow EAC-7300 Features** ■ Width 260 × Height 88 × Depth 215 mm ■ Equipped with NVIDIA Jetson T5000 module ■ Compatible with NVIDIA Isaac Perceptor software stack (AI robot development based on Isaac ROS) ■ Supports NVIDIA HoloScan Sensor Bridge: Achieves low-latency processing of diverse camera and sensor data ■ Equipped with 2,650-core NVIDIA Blackwell GPU ■ Supports 4 × 1GigE PoE+ ■ Expansion slots ・2 M.2 Key B sockets (3042/3052, USB 3.0, dual SIM compatible) (3042/3052/2280, PCIe x2) ・1 M.2 Key E socket (2230/3042, PCIe x1 / USB 2.0 / UART3) ■ Extended temperature support -25 to 70℃ (77W TDP mode, fan) / -25 to 45℃ (77W TDP mode, fanless) ■ Wide DC input 9 to 50V, ignition control compatible
