Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Apr 08, 2026～May 05, 2026
This ranking is based on the number of page views on our site.
31～60 item / All 260 items
BOXER S Series, designed for embedded systems, equipped with NVIDIA Jetson TX2.
Features ■ Width 153 × Height 30 × Depth 101 mm, 0.464 liters ■ Nvidia Jetson TX2 SOM fanless ■ 1 COM / 8 USB 3.0 / 1 USB 2.0 / 1 GbE ■ Operating temperature -20 to 50℃ (with airflow) ■ Wide DC input 10V to 24V ■ Vibration resistance 5 grms
6th generation Core i7 CPU, fanless, extended temperature support
Features ■ Width 200 × Height 85.3 × Depth 136.4 mm, 2.33 liters ■ 6th generation Core i7 6600U CPU, fanless operation ■ 2 DDR4 (up to 32GB) ■ 2 GbE, 4 USB3.0, 2 USB2.0, 1 COM ■ 1 2.5" SATA HDD/SSD ■ Dual display (DisplayPort) ■ Ultra wide temperature range -40 to 60℃ ■ Wide DC input 9V to 36V
For embedded systems, equipped with Core i5-6300U and Celeron 3855U.
Features ■ Width 255 × Height 130 × Depth 75 mm, 2.49 liters ■ Core i5-6300U 2.4GHz fanless ■ Celeron 3855U 1.6GHz fanless ■ Dual display (HDMI x 2) ■ 2.5" SATA HDD bays x 2 ■ Expansion module E-Windows x 2 ■ Operating temperature range -20 to 60℃ (with SSD)
FLEX series, equipped with Core i3-8100T and Pentium Gold G5400T, designed for systems supporting extended temperature.
Features ■ Width 357 × Height 88 × Depth 230 mm, 7.23 liters ■ Core i3-8100T / Pentium Gold G5400T 3.1GHz CPU ■ Chipset Q370 ■ PCIe 3.0 [x8] x 2, PCIe 3.0 [x4] x 2 ■ 2.5" SATA HDD bays (Hot-Swappable) x 4 ■ M.2 2280 (supports PCIe Gen 3.0 x4 NVMe SSD) x 2 ■ Operating temperature range -20 to 50℃ (with SSD) ■ Wall/Rack mount compatible
8th Generation 6 Cores Xeon/Core i7/i5/i3 (Coffee Lake-S), Fanless Embedded PC
Features ■ Width 330 × Height 210 × Depth 172 mm (RCX-1400FR/1400F) 11.92 liters ■ Width 250.4 × Height 210 × Depth 172 mm (RCX-1400R/1400) 9.04 liters ■ 8th generation 6 core Xeon/Core i7/i5/Celeron CPU (Coffee Lake-S), fanless operation ■ DDR4-2666MHz (up to 128GB) ■ 4K resolution support, 3 independent display outputs ■ 4 or 2 PCIe/PCI expansion slots, 2 Mini PCIe ■ 4 2.5" HDD front access (RCX-14**-*R) ■ 2 GbE, 6 USB3.1, 4 COM, 32 DIO ■ Extended temperature support -40 to 75℃ (when equipped with 35W TDP CPU) ■ Wide DC input 6 to 36V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certification
Fanless embedded PC for small embedded systems, equipped with a 7th generation CPU, supporting extended temperature range.
Features ■ Width 186 × Height 54 × Depth 147 mm, 1.48 liters ■ 7th generation Core i7 / 6th generation Core i7/i5/Celeron CPU, fanless operation ■ DDR4-2133MHz (up to 32GB) ■ 2 Mini PCIe expansion slots ■ 2 2.5" HDD/SSD ■ 3 GbE (2 PoE), 4 USB3.0, 2 COM, 32 GPIO/DIO ■ Extended temperature range -40 to 70°C ■ Wide DC input 6 to 36V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified
2U fanless rack-mounted GPU server for machine, factory, and building automation.
Features ■ 6th generation Core i7-6700/i5/i3 CPU, fanless operation ■ 4 DDR4 SO-DIMM (up to 64GB) ■ 2 2.5" SATA HDD/SSD ■ 2 10GbE, 4 GbE, 4 USB3.0 ■ Extended temperature range -40 to 50℃ ■ NVIDIA GTX950M / GTX1060 / GTX1080
5th generation Core i7 CPU, NVIDIA GT730M GPU, fanless, fully dustproof and waterproof IP65, extended temperature support.
Features ■ Width 220 × Height 44 × Depth 380 mm, 3.68 liters ■ MIL standard compliant (MIL-STD-810G temperature, shock, vibration) ■ 5th generation Core i7-5650U CPU, fanless operation ■ 2 DDR3L XR-DIMM (up to 16GB) ■ Extended temperature range -40 to 70°C ■ Fully dustproof and waterproof IP65 ■ Wide DC input 9V to 36V
Compact PC for machine, factory, and building automation.
Features ■ Width 308 × Height 76 × Depth 149 mm, 3.49 liters ■ Compliant with MIL standards (MIL-STD 810G) ■ 4th generation Core i7 Haswell CPU, fanless operation ■ DDR3 1600MHz (up to 8GB) ■ 2 mPCIe expansion slots ■ Onboard NANO SATA 3.0 SSD (up to 64GB) support ■ Multi-display with 4 DP ■ Extended temperature range -20 to 60°C ■ Wide DC input 9V to 36V
9th generation Core i7 CPU, NVIDIA RTX2080 GPU, fanless, extended temperature support
Features ■ Width 250 × Height 100 × Depth 204.2 mm, 5.10 liters ■ Compliant with MIL standards (MIL-STD 810G) ■ 9th/8th generation Core i7/i5/i3 CPU, fanless operation ■ 2 DDR4 SO-DIMM (up to 64GB) ■ Extended temperature range -20 to 60℃ ■ Wide DC input 9V to 48V
7th/6th generation Core i7 CPU, NVIDIA GTX950M GPU, fanless, fully dustproof and waterproof IP65, extended temperature support.
Features ■ Width 350 × Height 86 × Depth 230 mm, 6.12/6.92 liters ■ MIL standard compliant (MIL-STD 810G) ■ 7th/6th generation Core i7-7820EQ/6820EQ CPU, fanless operation ■ DDR4 XR-DIMM (up to 32GB) ■ 2 mPCIe expansion slots ■ Onboard NANO SATA 3.0 SSD (up to 64GB) / M.2 SSD (up to 1TB) compatible ■ Fully dustproof and waterproof IP65 ■ Extended temperature range -20 to 60℃ ■ Wide DC input 9V to 36V
5th generation Xeon D-1541 CPU, fanless, extended temperature support, 1U rack mount specification.
Features ■ Width 430 × Height 44.6 × Depth 380 mm, 7.28 liters ■ 1U rack mount specification ■ 5th generation Xeon D-1541 CPU, fanless operation ■ 4 DDR4 2400MHz (up to 128GB) ■ 2 2.5" SATA HDD/SSD ■ 1 PCIe [x16] slot ■ 2 GbE, 1 IPMI, 2 USB3.0, 4 USB2.0 ■ Extended temperature support -10 to 60℃
Railway, vehicle-mounted, compatible with 9th/8th generation CPUs, extended temperature range support.
Features ■ Width 260 × Height 79 × Depth 215 mm, 4.4 liters ■ 9th/8th generation Xeon/Core i7/i5/i3 CPU (Coffee Lake-R/S) ■ Fanless operation ■ DDR4-2666MHz (up to 64GB) ■ 4K resolution support, 4 independent display outputs ■ 4 front-access 2.5" HDDs ■ 6 USB3.1, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 6 GbE (4 PoE+ (M12)), 32 DIO ■ Extended temperature range -40 to 75°C (with 35W TDP CPU) ■ Wide DC input 6-36V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certification
Railway and vehicle-mounted, compatible with 9th/8th generation CPUs, extended temperature support.
Features ■ Width 260 × Height 104.1 × Depth 215 mm, 5.8 liters ■ 9th/8th generation Xeon/Core i7/i5/i3 CPU (Coffee Lake-R/S) ■ Fanless operation ■ DDR4-2666MHz (up to 64GB) ■ 4K resolution support, 4 independent display outputs ■ 4 front-access 2.5" HDDs ■ 6 USB3.1, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 6 GbE (4 PoE+), 32 DIO (ECX-1420) ■ 2 GbE, 16 GPIO (ECX-1320) ■ Extended temperature support -40 to 75°C (with 35W TDP CPU) ■ Wide DC input 6-36V ■ Control via ignition key (16 modes) ■ Railway standard EN50155 certified
Compatible with embedded systems, capable of mounting 9th/8th generation Core i7/i5/i3 CPUs.
Features ■ Width 210 × Height 77 × Depth 285 mm, 4.61 liters ■ Fanless system equipped with IBASE MB230 customized board ■ 9th/8th generation Core i7/i5/i3 Desktop CPU ■ DDR4-2666/2400 SO-DIMM, up to 32GB ■ Dual SIM slot supporting WWAN redundancy ■ 4x RJ45 Gigabit Ethernet ports (2x 802.3at PoE+ compatible) ■ 3x M.2 (B-Key/E-Key/M-Key) ■ Overvoltage/undervoltage/reverse voltage protection ■ iSMART, iAMT (11.6), TPM 2.0 ■ Rugged, vibration-resistant, cableless design ■ Remote power switch
Compatible with embedded systems, capable of mounting 9th/8th generation Core i7/i5/i3 CPUs.
Features ■ Width 210 × Height 109 × Depth 285 mm, 6.52 liters ■ Fanless system equipped with IBASE MB230 customized board ■ 9th/8th generation Core i7/i5/i3 Desktop CPU ■ DDR4-2666/2400 SO-DIMM, up to 32GB ■ Dual SIM slots supporting WWAN redundancy ■ 4x RJ45 Gigabit Ethernet ports (2x 802.3at PoE+ compatible) ■ 3x M.2 (B-Key/E-Key/M-Key) ■ Overvoltage/undervoltage/reverse voltage protection ■ iSMART, iAMT (11.6), TPM 2.0 ■ Flexible expansion slot system ■ 2x 2.5" storage (supports RAID 0/1) ■ Robust, vibration-resistant, cableless structure ■ Remote power switch
Compatible with embedded systems, capable of supporting 9th/8th generation Core i7/i5/i3 Desktop CPUs.
Features ■ Width 210 × Height 129 × Depth 285 mm, 7.72 liters ■ Fanless system equipped with IBASE MB230 customized board ■ 9th/8th generation Core i7/i5/i3 Desktop CPU ■ DDR4-2666/2400 SO-DIMM, up to 32GB ■ Dual SIM slot supporting WWAN redundancy ■ 4x RJ45 Gigabit Ethernet ports (2x 802.3at PoE+ compatible) ■ 3x M.2 (B-Key/E-Key/M-Key) ■ Overvoltage/undervoltage/reverse voltage protection ■ iSMART, iAMT (11.6), TPM 2.0 ■ Flexible expansion slot system ■ 2x 2.5" storage (supports RAID 0/1) ■ Robust, vibration-resistant, cableless structure ■ Remote power switch
For digital signage, equipped with AMD 3rd generation G series APU, Radeon (R4E) HD10000 graphics.
Features ■ Width 216 × Height 33 × Depth 150 mm, 1.07 liters ■ 3rd Generation AMD Embedded G-Series APU ■ Compact & Fanless Design ■ 1x DDR4-2133 Memory, supports up to 16GB ■ Radeon (R4E) HD10000 Series GPU ■ 2x HDMI (supports Hardware EDID emulation) ■ 1x M.2 B key (3042) for storage or 4G LTE option ■ 1x Mini PCI-E (full-size) for Wi-Fi, Bluetooth, or 4G LTE ■ iCONTROL (energy-saving, remote control technology)
Equipped with C246/H310 chipsets for embedded systems, 8th generation Core i7/i5/i3.
Features ■ Width 264.2 × Height 80.92 × Depth 156.2 mm, 3.11 liters ■ Supports 8th generation Xeon/Core i7/i5/i3 Desktop CPUs, fanless ■ Memory DDR4 2133 SO-DIMM, maximum 32GB ■ 6 COM / 4 GbE (i211 x 3 + i219 x 1, supports iAMT) ■ 8 USB3.2 (C246) / 4 USB3.2 + 4 USB2.0 (H310) ■ HDMI x 2 (HDMI 4K Display) ■ Intel GbE LAN x 4 (i211 x 3 + i219 x 1), supports iAMT ■ BIOS selectable RS-232/422/485 x 6 support ■ Operating temperature -20 to 55°C (with airflow, for extended temperature storage use) ■ Operating temperature -20 to 45°C (with airflow, for extended temperature storage use) (Xeon) ■ Wide DC input 10V to 35V
BOXER AI@Edge Series for Embedded Systems, equipped with NVIDIA Jetson Nano
Features ■ Width 88 × Height 39 × Depth 75 mm, 0.257 liters ■ Nvidia Jetson Nano SOM fanless ■ Quad Core ARM A57 processor ■ 4GB LPDDR4 + 16GB Micro-SD or eMMC ■ LAN x 1 + RS-232 x 2 ■ 2 COM / 4 USB3.2 / 1 MicroUSB (Flash OS) / 1 GbE ■ DC input 12V ■ Operating temperature -20 to 50°C ■ Vibration resistance 3grms
MXE Series for Embedded Systems, equipped with 9th Generation Xeon/Core i7/i5/i3
Features ■ Width 210 × Height 86 × Depth 240 mm, 4.33 liters ■ Fanless Xeon E-2276ME/Core i7-9850HE/i5-8400H/i3-9100HL CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++1.2, 1 HDMI ■ Abundant I/O 2 GbE, 4 USB3.1 (2 Gen2 + 2 Gen1), 5 USB2.0, 4 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 9V to 32V ■ DIO 8 DI + 8 DO
MVP Series for Embedded Systems, equipped with 9th generation Core i7/i5/i3.
Features ■ Width 210 × Height 86 × Depth 240 mm, 4.33 liters ■ Fanless Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++ 1.2, VGA, DVI ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 4 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V ■ DIO 8 DI + 8 DO
For embedded systems, equipped with 9th generation Core i7/i5/i3, NVIDIA Quadro Embedded GPU can be installed.
Features ■ Width 125 × Height 210 × Depth 240 mm, 6.3 liters ■ Core i7-9700E/i7-9700TE/i5-9500TE/i3-9100TE/Celeron G4900T CPU ■ NVIDIA Quadro Embedded P1000/P2000/P3000/P5000 GPU ■ Memory DDR4 SO-DIMM (up to 32GB) ■ Dual display 2 DP++, 1 VGA/DVI, Extra 4 DP1.4 / 3 DP1.4 ■ Abundant I/O 3 GbE, 3 USB3.1, 4 USB2.0, 3 COM ■ Robust, vibration-resistant, cableless structure ■ Wide DC input 12V to 24V
Railway and in-vehicle use, equipped with Intel 8th generation Core i7-8665UE/i3-8145UE CPU, supports extended temperature range.
Features ■ Width 224 × Height 32.6 × Depth 149 mm, 1.09 liters ■ 8th Generation Intel Core i7-8665UE/i3-8145UE CPU (Whiskey Lake) ■ Two DDR4 2400MHz memory slots, expandable up to 64GB ■ Two DP ports supporting high-definition 4K video output ■ Four USB 3.1 ports, capable of data transfer up to 10Gbps ■ Four independent GigE LAN ports, supporting IEEE 802.3at PoE+ (2 ports) ■ 5G/WiFi/4G/3G/LTE/GPRS/UMTS support via SIM socket ■ Four COM ports (RS-232/422/485), equipped with 16 isolated DIO ■ Wide DC power input range of 9V to 50V ■ Extended operating temperature range of -40℃ to 85℃, with a clean cable-free design ■ Ignition control capable (16 modes), supports TPM 2.0 ■ Rich expansion features (M.2 Key B, M, E and Mini PCIe)
Railway and vehicle-mounted, compatible with 10th generation CPUs, capable of mounting PEG graphics cards, supports extended temperature range.
Features ■ Width 260 × Height 79 × Depth 240 mm, 4.93 liters ■ 10th Generation Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ DDR4-2933MHz (up to 64GB) ■ Can supply power to graphics cards up to 250W ■ 1 VGA, 1 DVI-D, 2 DP (supports 4K resolution), 4 independent display outputs ■ Expansion features: 1 PCIe [x16], 1 M.2 KeyB, 1 M.2 KeyE, 2 Mini PCIe ■ 2.5" HDD front access for 2 drives ■ 6 USB3.2, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 2GbE / 2GbE + 4 PoE ■ Extended temperature support -20 to 45°C ■ Wide DC input 12 to 50V ■ Control via ignition key through software ■ Railway standard EN50155 certified
For digital signage, AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz
Features ■215.8mm(W) x 164mm(H) x 45mm(D) / ■AMD Ryzen Embedded V1605B 2.0GHz/3.6GHz ■Supports 2x DDR4-2400 memory up to 32GB ■4x HDMI 2.0 (with EDID emulator) ■Rich expansion slots ■Mini PCIe (Full-size): for communication such as Wi-Fi, Bluetooth, 4G LTE ■M.2 E-Key (2230): for communication such as Wi-Fi, Bluetooth ■1x SIM card slot
For digital signage, 8th generation Intel Core mobile processor (TDP <= 25W)
Features ■ 175mm(W) x 116mm(H) x 30mm(D) ■ Ample expansion slots ■ M.2 E-Key (2230) for card capture ■ M.2 M-Key (2280) for memory ■ 1x M.2 B-Key (3042) for 4G LTE ■ Intel Core i7-8665UE processor ■ 2x DDR4 2400 SO-DIMM (up to 32GB)
Railway/vehicle use, Intel Atom x7-E3950 processor, 64G MLC SSD, 9V~32VDC input.
Features ■340 (W) x 183.4 (D) x 67.6 (H) mm ■Intel Atom x7-E3950 processor ■Abundant expansion slots ■1x miniPCI-E full/Half-size, supports mSATA ■1x miniPCI-E full/Half-size, supports second SIM card ■shared with M.2 slot ■1x M.2 B-key 30x42 with USB 2.0 and USB 3.0 signal only ■4x Gigabit LAN ■512k SRAM on board ■2.5-inch drive bay
For embedded systems, AMD Embedded Ryzen Series SoC V1605B/V1202B/R1606G/1505G
Features ■240mm (W) x 162mm (D) x 42mm (H) 1.63 liters ■Ryzen Series SoC V1605B/V1202B/R1606G/1505G ■Internal expansion: 2x M.2 (E-Key / M-Key) ■Fanless operation temperature ■I/O connectors (front) ■1x Power LED/ 1x HDD LED/ 1x RST button/ ■1x USB 3.0/2.0 by V1605B/ V1202B/ R1606G/ R1505G ■3x DB9 for COM#2~4 (RS232) etc. ■I/O connectors (rear) ■4 x USB 3.1, 2x HDMI (2.0a), 1x DB9 for COM#1 (RS232/422/485) ■2x LAN, 1x Digital I/O (4-in/4-out) ■1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%) ■2x Antenna holes etc.
Equipped with 8th generation Core i mobile CPU for embedded systems.
Features ■ 180mm(W) x 150mm(D) x 66mm(H) 1.78 liters ■ 8th generation Core i7-8665UE / i5-8365UE / i3-8145UE CPU ■ Internal expansion slots 2x M.2 (E-Key, M-Key) ■ I/O connectors (front) ■ 4x USB 3.1, 2x DP, 1x DB9 for COM#1 (RS232/422/485), 2x Gigabit LAN ■ I/O connectors (rear) ■ 1x Power button, 1x Digital I/O (4-in/4-out), 2x Antenna holes, 1x HDD LED, 1x 3-pin DC-in terminal block for 12V(-10%) ~ 24V(+10%)
