Railway and vehicle-mounted, compatible with 10th generation CPUs, capable of mounting PEG graphics cards, supports extended temperature range.
Features ■ Width 260 × Height 79 × Depth 240 mm, 4.93 liters ■ 10th Generation Xeon/Core i9/i7/i5/i3 CPU (Comet Lake-S) ■ DDR4-2933MHz (up to 64GB) ■ Can supply power to graphics cards up to 250W ■ 1 VGA, 1 DVI-D, 2 DP (supports 4K resolution), 4 independent display outputs ■ Expansion features: 1 PCIe [x16], 1 M.2 KeyB, 1 M.2 KeyE, 2 Mini PCIe ■ 2.5" HDD front access for 2 drives ■ 6 USB3.2, 1 USB2.0, 4 COM, 3 SIM Card slots ■ 2GbE / 2GbE + 4 PoE ■ Extended temperature support -20 to 45°C ■ Wide DC input 12 to 50V ■ Control via ignition key through software ■ Railway standard EN50155 certified
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basic information
Specifications ■CPU/Chipset: 10th Generation Xeon/Core i9/i7/i5/i3 (Comet Lake-S)/W480E ■Memory: DDR4-2933MHz SO-DIMM x2 (up to 64GB) ■Expansion Slots: PCIe [x16] x1, PCIe [x4] x1, M.2 x2 (Key B+E), Mini PCIe x2 ■Storage: 2.5" HDD/SSD x2 (SATA3) (front operation), mSATA x2, M.2 (Key M) ■I/O Connectors: GigE (iAMT) x1, GigE x1, GigE (PoE+) x4 (ECX-2200 PEG) USB 3.2 x6, USB 2.0 x1, RS-232/422/485 (ESD 8KV) x4, VGA x1, DVI-D x1, DP x2 Isolated DIO (16DI, 16DO) x1 (ECX-2200 PEG) / 16 GPIO x1 (ECX-2100 PEG), Audio Mic-in, Line-out ■Input Power: DC 12–50V input (3-pin terminal block: On, Off, IGN) ■Operating Temperature: -20–45°C ■Dimensions (WxHxL) / Weight: 260 x 79 x 240 mm / 4.5 kg
Price information
Open price
Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
Railway, onboard, for machine, factory, and building automation/surveillance systems.
Line up（19）
| Model number | overview |
|---|---|
| ECX-2200 PEG | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16] |
| ECX-2200F PEG | 6 GigE LAN (4 PoE+), Isolated DIO, 1 PCIe[x16], FAN sink (supports 95W TDP CPU) |
| ECX-2100 PEG | 2 GigE LAN, 16 GPIO, 1 PCIe[x16] |
| ECX-2100F PEG | 2 GigE LAN, 16 GPIO, 1 PCIe[x16], FAN sink (supports 95W TDP CPU) |
| CPU Xeon W-1290E | 10th Gen Xeon W-1290E (20M Cache, 4.8GHz, 95W TDP, supports ECC memory) |
| CPU Xeon W-1290TE | 10th Gen Xeon W-1290TE (20M Cache, 4.5GHz, 35W TDP, supports ECC memory) |
| CPU Xeon W-1270E | 10th Gen Xeon W-1270E (16M Cache, 4.8GHz, 80W TDP, supports ECC memory) |
| CPU Xeon W-1270TE | 10th Gen Xeon W-1270TE (16M Cache, 4.4GHz, 35W TDP, supports ECC memory) |
| CPU Xeon W-1250E | 10th Gen Xeon W-1250E (12M Cache, 4.7GHz, 80W TDP, supports ECC memory) |
| CPU Xeon W-1250TE | 10th Gen Xeon W-1250TE (12M Cache, 3.8GHz, 35W TDP, supports ECC memory) |
| CPU Core i9-10900E | 10th Gen Core i9-10900E (20M Cache, 4.7GHz, 65W TDP) |
| CPU Core i9-10900TE | 10th Gen Core i9-10900TE (20M Cache, 4.5GHz, 35W TDP) |
| CPU Core i7-10700E | 10th Gen Core i7-10700E (16M Cache, 4.5GHz, 65W TDP) |
| CPU Core i7-10700TE | 10th Gen Core i7-10700TE (16M Cache, 4.4GHz, 35W TDP) |
| CPU Core i5-10500E | 10th Gen Core i5-10500E (12M Cache, 4.2GHz, 65W TDP) |
| CPU Core i5-10500TE | 10th Gen Core i5-10500TE (12M Cache, 3.7GHz, 35W TDP) |
| CPU Core i3-10100E | 10th Gen Core i3-10100E (6M Cache, 3.8GHz, 65W TDP, supports ECC memory) |
| CPU Core i3-10100TE | 10th Gen Core i3-10100TE (6M Cache, 3.6GHz, 35W TDP, supports ECC memory) |
| Options | 280W/160W Industrial AC Adapter, VESA Mount Kit, DIN-RAIL Kit, DDR4 Memory (4GB/8GB/16GB/32GB) |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
