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High-Precision Micro-Multi-Hole Processing Case for PI (Polyimide)

We performed multi-hole processing in a staggered grid pattern on a 50μm thick PI (polyimide) with an entrance diameter of Φ17μm, an exit diameter of Φ6μm, and a pitch of 25μm.

Holes were processed in a staggered lattice pattern on a 50μm thick PI (polyimide) with an inlet diameter of Φ17μm, an outlet diameter of Φ6μm, and a pitch of 25μm.

• Company：リプス・ワークス
• Price：Other

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