PuriKen Co., Ltd. Printed Circuit Board Resin Filling
After drilling, there is a process of resin filling and lid plating following copper plating!
Our company performs "resin filling" using process equipment. Conductive metal and non-conductive non-metal pastes are applied to the surface of the substrate, and after being embedded in the holes, they are printed using a screen plate. By overheating and curing the resin, and then performing lid plating after polishing, a flat surface is achieved. 【Process】 1. Drilling 2. Copper plating 3. Resin filling 4. Lid plating *For more details, please refer to the PDF document or feel free to contact us.
- Company：プリケン 本社、山形営業所、神奈川営業所、関西営業所、福岡営業所
- Price：Other
