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The "contact probe" is a component used for probe pins in the electrical inspection process of semiconductor wafers and IC packages. It achieves stable processing accuracy even with extremely small diameters and short dimensions, making it suitable for fine electrodes and precision contact parts. It balances short delivery times and quality stability through in-house completion, minimizing variations between processes. Additionally, it ensures both signal stability and durability through heat treatment and various plating processes (Ni-P, Au, AuCo, Pd, Rh), achieving contact reliability and long lifespan in high-frequency and microcurrent measurements. 【Features】 - Supports precision cutting processing from a material diameter of φ0.6mm - Numerous manufacturing achievements for fine parts with a minimum processing diameter of φ0.05 and a total length of less than 1mm - Drilling processing can accommodate a minimum diameter of φ0.1 - Thickness specifications can be accommodated for various platings such as Ni-P, Au, PdCo, and Rh, and heat treatment is also supported - A comprehensive in-house system from high-precision processing to surface treatment - By collaborating with our inspection company located overseas, we have established a high-quality system that meets global quality standards *For more details, please feel free to contact us.