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  1. Home
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  3. ティ・ディ・シー
Other manufacturing
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ティ・ディ・シー

EstablishmentJanuary 1989
capital3000Ten thousand
number of employees60
addressMiyagi/Rifu-cho, Miyagi-gun/24-15 Chōjafront, Itaduki, Fukuoka
phone022-356-3131
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last updated:Jun 12, 2020
ティ・ディ・シーlogo
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  • Company information
  • Products/Services(20)
  • catalog(14)
  • news(51)

ティ・ディ・シー Company Profile

We handle grinding, cutting, and general machining. In particular, we can achieve ultra-precision processing and difficult machining of various materials and shapes using our unique grinding technology.

We specialize particularly in ultra-precision mirror surface processing, with a maximum size capability of φ1500 for single-sided machines. We excel in improving flatness, parallelism, and surface roughness for precision stages and suction plates. For suction plates around φ300*10t, we produce with flatness of 0.001, parallelism of 0.001, and Ra below 0.01 (for SUS material). For φ100*5t (materials such as SUS, Ni, Ti, Mo, Ta, W, ceramics, Si, etc.), we can manufacture plates with precision of less than 0.001 in flatness and around Ra 0.001, which are used as ultra-high precision jigs and molds. ◆ Selected as one of the 300 vibrant small and medium-sized manufacturing companies in 2007. ◆ ◆ Chosen as one of the "Global Niche Top 100 Companies" by the Ministry of Economy, Trade and Industry in 2014. ◆ Selected as a "Regional Future Leading Company" by the Ministry of Economy, Trade and Industry in 2018.

Business Activities

We specialize in precision machining such as polishing, grinding, and cutting. We also have various ultra-precision measuring instruments in-house, enabling us to guarantee quality at the nano level. We can manage everything from material procurement to machining and finishing in a single process.

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Products/Services (20)

High-precision roll product image
High-precision roll
Flatness 30nm [Ultra-precision lap] [Mirror polishing] product image
Flatness 30nm [Ultra-precision lap] [Mirror polishing]
Surface roughness Ra1nm [Precision grinding / Mirror finish] [Wrapping] product image
Surface roughness Ra1nm [Precision grinding / Mirror finish] [Wrapping]
Nano-level ultra-precision product image
Nano-level ultra-precision

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catalog(14)

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High-precision roll

High-precision roll

PRODUCT
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Nano-level ultra-precision

Nano-level ultra-precision

OTHER
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TDC Corporation Company Profile

TDC Corporation Company Profile

COMPANY
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Grinding technology "Precision mirror surface cylindrical rolls/shafts"

Grinding technology "Precision mirror surface cylindrical rolls/shafts"

TECHNICAL
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news(51)

Invitation to the ICEP2021 Exhibition

  • SEMINAR_EVENT

The international conference ICEP 2021 will be held online for three days from May 12 (Wednesday) to May 14 (Friday). This conference will discuss the challenges of implementation technology through a wide range of sessions including Advanced Packaging, Interconnection, 3DIC Packaging, Design, Modeling and Reliability, Thermal Management, Materials and Processes, Printed Electronics, MEMS, Optoelectronics, and Power Devices, with over 120 presentations from 10 countries and 4 keynote speeches planned. In ICEP 2019, 413 participants gathered. Unfortunately, last year the event was canceled due to the new virus situation, but it has been decided to hold it online this year. TDC will also exhibit at the accompanying exhibition. You can apply from the URL below. We look forward to seeing you at our online booth.

Apr 21, 2021

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Invitation to the ICEP2021 Exhibition

  • SEMINAR_EVENT

The international conference ICEP 2021 will be held online for three days from May 12 (Wednesday) to May 14 (Friday). This conference will serve as a platform to discuss challenges in implementation technology with a wide range of session topics including Advanced Packaging, Interconnection, 3DIC Packaging, Design, Modeling and Reliability, Thermal Management, Materials and Processes, Printed Electronics, MEMS, Optoelectronics, and Power Devices, with over 120 presentations from 10 countries and 4 keynote speeches planned. In ICEP 2019, 413 participants gathered. Unfortunately, last year’s event was canceled due to the new virus situation, but it has been decided to hold this year’s conference online. TDC will also exhibit at the accompanying exhibition. You can apply via the URL below. We look forward to seeing you at our online booth.

Apr 21, 2021

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The 2021 MEF (Online Conference and Exhibition) starts today!

  • SEMINAR_EVENT

★MEMS Engineer Forum (MEF), April 21 (Wednesday) - 22 (Thursday) Finally, it starts online today! TDC will also have an exhibition booth, so please join us. Everyone can participate for free. ★ The online exhibition and on-demand content will be available until May 31. ★ Simultaneous interpretation in Japanese and English will be provided. Access for those who have already registered: https://cvent.me/0KRR2B For those who will register now, please access the link below and complete your registration. https://cvent.me/zPkx8w <MEF 2021 Program Schedule> https://www.m-e-f.info/2021-program/

Apr 21, 2021

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Detailed information

Company name ティ・ディ・シー
number of employees60
Contact addresspostalcode 981-0113 Miyagi/ Rifu-cho, Miyagi-gun/ 24-15 Chōjafront, Itaduki, FukuokaView on map TEL:022-356-3131 FAX:022-356-3578
Industry Other manufacturing
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