株式会社 産研舎 List of Products and Services

We manufacture silicon crucible testers. Silicon is used for material research due to its low impurity levels. We can process any type of sintered material, including ceramics, glass, and quartz. Please make use of our products for research and development in semiconductor manufacturing equipment and for experimental purposes. 【Features】 ■ Leveraging nearly 60 years of experience to propose optimal processing methods ■ A short delivery system that can deliver in as little as one week from order *For more details, please refer to the materials available for download in the catalog. Feel free to contact us with any inquiries.

• Processing Contract

Our company offers contract processing services for wafers, including circular and rectangular notching and inch-down processing. We accommodate a variety of materials such as silicon, ceramics, glass, and quartz, and we can also process wafers with orientation flats. Please make use of our services for research and development and prototyping in semiconductor manufacturing equipment. 【Features】 ■ Leveraging nearly 60 years of experience to propose optimal processing methods ■ Support for orders from a minimum of 1 piece to 100 pieces per month ■ Short delivery times, with the fastest delivery within 1 week from order *For more details, please refer to the materials available for download in the catalog. Feel free to contact us with any inquiries.

• Processing Contract

Silicon grinding bridge, mortar processing

• Processing Contract

It is a product with strict precision machining.

• Processing Contract

Mainly, we perform drilling processing for wafer inch-down.

• Wafer processing/polishing equipment

Sputtering: Several pieces of tile-shaped silicon are joined together and used as side sputtering.

• Sputtering Equipment

This is a fixture for processing thin silicon wafers aligned with the surface orientation (notch). It also meets various needs according to the wafer's inch size.

• Processing Contract

It has been finely processed with a total length of 12mm, with φ0.5 at 5mm, φ0.8 at 3mm, and φ1mm at 3mm. It is also possible to accommodate a silicone rod inside. Since processing from both the top and bottom is required, height management is important and requires considerable ingenuity. Sometimes, specialized jigs are created.

• Other semiconductors

It will be processed by a machining center, but due to the very delicate handling required, special methods will be used for cleaning during processing and after the process is completed, with some tasks being carried out manually. Careful attention will be paid at every stage, and measures will be taken to prevent breakage during packaging, which will be done in specialized containers.

• Other semiconductors

Silicon cut from a 30-degree angle was processed into a polyhedron using a special axis. Precision three-dimensional processing of materials like glass is difficult because they are sintered bodies, requiring considerable ingenuity to achieve processing accuracy by completion. Since processing marks and cracks can easily occur, a sufficient processing image is necessary.

• Other semiconductors

The "Polycoat Glassine Paper Bag" is a packaging material developed to securely store and seal semiconductor wafers, pellets, quartz wafers, pellets, glass products, ferrites, metal test pieces, and more without taking up volume. It features a special glassine paper (approximately 20μ thick) laminated with a polyethylene sheet (approximately 13μ thick) without the use of release materials, resulting in a distinctive bag. Additionally, since no release materials are used, the contents can be stored in their current state, and the outer side of the bag is made of glassine paper while the inner side is polyethylene, allowing for easy sealing with a sealer. 【Features】 ■ Laminated bag without the use of release materials ■ Can be stored in their current state ■ Can be easily sealed with a sealer ■ Items with a border display have a fold at the bag's entrance similar to an envelope *For more details, please download the PDF or feel free to contact us.

• Packaging Bags
• Other packaging equipment, materials and tools

The "Sanwax MTC-201" is an adhesive designed with the consideration that the performance of the wax does not change with heating. It is versatile for applications such as ultrasonic, slicing, dicing, wrapping, and centerless processes, and has the combined effectiveness of both "TXW" and "CHV-101". Additionally, it can be removed by boiling with alcohol or neutral detergent. Please feel free to contact us when you need assistance. 【Features】 ■ Versatile for ultrasonic, slicing, dicing, wrapping, and centerless processes ■ Has the combined effectiveness of "TXW" and "CHV-101" ■ Can be removed by boiling with alcohol or neutral detergent *For more details, please download the PDF or feel free to contact us.

• glue

"Sanwax SPTC-10155" is an adhesive designed for processing, taking into account that the workpiece is adequately held during processing. It has reduced fluidity, and once processing is complete, it can be easily removed with solvents or detergents, without affecting the workpiece or product due to the use of the adhesive. Additionally, it has the characteristic that the performance of the wax does not change with temperature (heating). [Features] ■ Reduced fluidity *For more details, please download the PDF or feel free to contact us.*

• glue

"Sanwax TXW" is a processing adhesive designed with considerations such as minimal saw blade clogging during cutting. It is a domestic product with ceramic as its main component, serving as a substitute for Tanwax. Additionally, it is suitable for slicing, dicing, and wrapping, and can be removed by boiling with alcohol or neutral detergent. 【Features】 ■ Main component is ceramic ■ Domestic product that serves as a substitute for Tanwax ■ Suitable for slicing, dicing, and wrapping ■ Removable by boiling with alcohol or neutral detergent *For more details, please download the PDF or feel free to contact us.

• glue

"Sanwax CHV-101" is an adhesive for cutting, grinding, polishing, and ultrasonic processing. It is primarily composed of shellac, is strong against vibration processing, and is suitable for ultrasonic processing. It has vibration transmission properties and flexibility, which can prevent cracks at the end of processing. Additionally, it can be easily removed by boiling in a neutral detergent. Please feel free to contact us if you need assistance. 【Features】 ■ Primarily composed of shellac ■ Strong against vibration processing and suitable for ultrasonic processing ■ Can prevent cracks at the end of processing ■ Easily removable by boiling in a neutral detergent *For more details, please download the PDF or feel free to contact us.

• glue

Our company significantly contributes to the development of the electronics industry through the slicing and lapping processing of materials such as silicon, ceramics, quartz, and ferrite, as well as the manufacturing and sales of auxiliary materials. We perform precision processing of silicon, alumina, glass, Si wafers, and semiconductor compounds using advanced technology and know-how. In particular, we specialize in the processing of unique shapes using silicon. We aim to improve our quality and services daily so that we can continue to grow alongside our customers and advance as a valuable company. 【Business Activities】 ■ Slicing and lapping processing of materials such as silicon, ceramics, quartz, and ferrite, as well as the manufacturing and sales of auxiliary materials. *For more details, please download the PDF or feel free to contact us.

• Processing Contract
• Wafer
• Other semiconductors

This is a device that adapts to any type of three-dimensional processing. Please feel free to contact us regarding three-dimensional processing.

• Other processing machines

This is a product that utilizes our cutting-edge programming and 3-axis and 5-axis machining. For detailed information, please contact us.

• Other semiconductors

This is a sample of ultra-thin wrapping using a 4-way wrapping machine. For more details, please contact us.

• Other packaging materials

During the machining of sintered bodies, many cracks and chips occur, but we process them using our unique machining method and perform special handling for cleaning and packaging after processing.

• Non-ferrous metals