We also process ultra-thin silicone rings with high precision.
It will be processed by a machining center, but due to the very delicate handling required, special methods will be used for cleaning during processing and after the process is completed, with some tasks being carried out manually. Careful attention will be paid at every stage, and measures will be taken to prevent breakage during packaging, which will be done in specialized containers.
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Miyano Manufacturing Co., Ltd. Machining Center Okuma Machining Center
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Our company specializes in precision processing of silicon, ceramics, quartz, alumina, glass, silicon wafers, and semiconductor compounds using advanced technology and know-how. Additionally, through the manufacturing and sales of wrapping materials and auxiliary materials, we significantly contribute to the development of the electronics industry.