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"BeLight " is an ultra-low dielectric film that reduces transmission loss in the high-frequency range. It maintains a dielectric loss tangent of 0.0003 (28GHz), achieving a level higher than the mainstream fluoropolymer. Additionally, this film is easy to process with lasers and has strong adhesion to copper foil and low water absorption. [Features] ■ Reduces transmission loss in the high-frequency range ■ Dielectric loss tangent of 0.0003 (28GHz) ■ Achieves a level higher than the mainstream fluoropolymer ■ Easy to process with lasers *For more details, please refer to the related links or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that achieves both ultra-low dielectric properties and high adhesion to copper foil. With a dielectric constant of 2.2 and a dielectric loss tangent of 0.0004@28GHz (SNL type), it features low transmission loss equivalent to that of fluoropolymer materials. It uses lower-cost materials compared to current low-dielectric materials, such as LCP or PTFE. It can be used both as an adhesive for FFC and as a substrate, allowing for the reduction of dielectric properties in the insulating part (adhesive + substrate) when using this product. 【Features】 ■ Dielectric constant of 2.2, dielectric loss tangent of 0.0004@28GHz (SNL type) ■ Low transmission loss comparable to or better than fluoropolymer materials ■ Low water absorption (<0.1%) *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that combines ultra-low dielectric properties with high adhesion to copper foil. It features high adhesion to low-roughness copper foil (up to 40N/cm), as well as lamination and flexibility due to the thermoplastic resin. It is well-suited for applications in Flexible Flat Shield Cable (FFSC) SDL type, with good adhesion to copper foil and UV laser processability. 【Features】 ■ High adhesion to low-roughness copper foil (up to 40N/cm) ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that achieves both ultra-low dielectric properties and high adhesion to copper foil. In addition to low water absorption (less than 0.1%), we can also provide additional functionalities, including heat resistance (max. 260°C), flame retardancy (VTM-0, halogen-free), and laser machinability. It can be used in applications such as Flexible Flat Cables (FFC), Flexible Flat Shield Cables, and transparent antennas. 【Features】 ■ Low water absorption (less than 0.1%) ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

The thermoplastic ultra-low transmission loss film "BeLight" is a high-speed communication material that combines ultra-low dielectric properties with high adhesion to copper foil. It has a transmission loss that is equal to or better than that of fluoropolymer resins and uses lower-cost materials compared to current low-dielectric materials. It is suitable for applications such as Flexible Flat Cables (FFC), Flexible Flat Shield Cables, and transparent antennas. 【Features】 ■ Low transmission loss equal to or better than fluoropolymer resins ■ Ultra-low dielectric ■ Processability ■ Multifunctional *For more details, please download the PDF or feel free to contact us.

Introducing the applications of the thermoplastic ultra-low transmission loss film "BeLight" used in the insulation material of flat cables. With the trend towards thinner devices, flat cables have become mainstream. Conventional materials face issues: PI and PET are unsuitable for high-frequency applications, while LCP is expensive and has poor processability. This product can be used both as an adhesive for FFC and as a substrate. By using this product, the insulation part (adhesive + substrate) can be made low dielectric. 【Expected Benefits (FFC Applications)】 ■ Reduction of transmission loss - By lowering the dielectric constant and dielectric loss tangent, it contributes to the suppression of signal attenuation, especially in high-frequency bands. ■ Thinning and flexibility of cables - With a low dielectric constant, it contributes to the thinning of the insulation layer required for the specified characteristic impedance and enhances cable flexibility. *For more details, please download the PDF or feel free to contact us.

We will introduce the applications of the transparent antenna's thermoplastic ultra-low transmission loss film "BeLight." The features of CCL (Copper Clad Laminate) formation and conductor formation through sputtering and plating allow for the development of transparent antennas while maintaining the film's transparency due to low transmission loss and fine circuit formation. Additionally, it exhibits suppression of curl/warping and good adhesion, enabling applications in FPC (Flexible Printed Circuit) in combination with low-temperature mounting. [Features of conductor formation through sputtering and copper plating] - Thin film conductors with smooth interfaces - High-energy process without high temperatures *For more details, please download the PDF or feel free to contact us.