三菱ケミカル Company Profile

We will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO)" to be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Please stop by our booth at East Hall 3, E21-2. At the exhibition, we will introduce "Alset," a metal and resin film laminated material. Alset is an ideal material for next-generation laminated busbars and flexible busbars. It enables high current and high frequency busbars suitable for electric vehicles while also allowing for weight reduction. Additionally, its flexibility helps eliminate cracking caused by vibrations in vehicles. Event Name: 39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO) Dates: January 22 (Wednesday) to January 24 (Friday), 2025 Venue: Tokyo Big Sight, East Hall 3, E21-2 Official Website: https://www.nepconjapan.jp/tokyo/ja-jp.html We sincerely look forward to your visit.

We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition in Nagoya." Since the film is laminated onto the metal, the following functions can be achieved: - Omission of the insulation film lamination process - Omission of the metal painting process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, bus bars If the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold, resulting in the following functions after cooling: - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Event dates: July 17 (Wednesday) to July 19 (Friday), 2024 Opening hours: All three days: 10:00 AM to 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth: 9 Please feel free to stop by!

We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition in Nagoya." Since the film is laminated onto the metal, the following functions can be achieved: - Omission of the insulation film lamination process - Omission of the metal painting process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, bus bars If the film layer of Alset and the resin to be molded can be thermally welded, the film and molded resin will thermally bond within the mold, resulting in the following functions after cooling: - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU PCU enclosures and components, automotive components such as battery parts Event dates: July 17 (Wednesday) to July 19 (Friday), 2024 Opening hours: All three days from 10:00 AM to 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth: 9 Please feel free to stop by!