We will exhibit the resin film and metal laminate "Alset" at the "2024 Automotive Technology Exhibition in Nagoya."

Contributes to the omission of the insulating film lamination process, miniaturization of metal parts, and the addition of electromagnetic wave shielding properties to resins! Development of laminated busbar materials for high current applications is also underway!

Aruset is a composite material that strongly laminates metal and resin film without using adhesives. You can choose the combination of metal and film according to your preferences. 【Features】 ■ Omission of the insulating film lamination process ■ Omission of the metal coating process ■ Miniaturization and space-saving of components (reduction of insulation distance) ■ Compatibility of insulation and heat dissipation (compared to resin) ■ Joining metal and resin using only heat 【Exhibition Information】 Aruset will be exhibited at "Nepcon Japan" as a suitable material for next-generation laminated busbars. It enables busbars that support high current and high frequency for EV applications, while also allowing for weight reduction. Its flexibility eliminates cracking due to vibrations in automobiles. Event Name: 39th Nepcon Japan Electronics Development and Implementation Exhibition (26th Electronic Components and Materials EXPO) Date: January 22 (Wednesday) to 24 (Friday), 2025 Venue: Tokyo Big Sight, East Hall 3, E21-2 *For detailed specifications, please download the PDF. Feel free to contact us for more information.

• Capacitor

Composite of metal and resin possible with heat alone!

When the film layer of Arset and the resin to be molded are a thermally weldable combination, the film and the molded resin thermally weld together in the mold and become integrated after cooling. - Composite of metal and resin using only heat - Lightweight metal - Electromagnetic wave shielding for resin - Improved heat dissipation

• converter

It is a composite material that strongly laminates metal and resin film without using adhesives. It is suitable for insulation of metal and bonding between metal and resin.

**Features** 1. By selecting injection-molded pellets and thermally weldable films as the film layer of Arset, heterogeneous bonding of metal and resin can be achieved within the mold. Since it is welded solely by heat, no pre-treatment of the metal or resin is necessary. 2. Because no adhesives are used, there is no concern about cohesive failure at the adhesive layer even when processed into complex shapes. 3. Since the film is laminated onto the metal, subsequent processes such as insulation and metal protection that require applying films are unnecessary. 4. Since the film is laminated onto the metal, printing that cannot be done directly on the metal can be applied.

• inverter

It is a composite material that is strongly laminated without using adhesives between metal and resin films. It is suitable for insulation of metals and bonding between metal and resin.

Aruset is a composite material that strongly laminates metal and resin film without using adhesives. You can choose combinations according to your preferences. • Metals: Aluminum, SUS, SECC, ZAM, copper (development product), etc. • Resin films: PA, PP, UHMWPE, fluorine-based, PET, etc. PC, PBT, PPS, and PEI are also currently under development. We may be able to accommodate metals and films not listed here, so please feel free to contact us. 【Exhibition Information】 We will exhibit Aruset at "Nepcon Japan" as an ideal material for next-generation laminated busbars. It enables high current and high-frequency busbars suitable for EVs while also allowing for weight reduction. Furthermore, its flexibility eliminates cracking due to vibrations in vehicles. Event Name: 39th Nepcon Japan Electronics Development and Implementation Exhibition (26th Electronic Components and Materials EXPO) Date: January 22 (Wednesday) to 24 (Friday), 2025 Venue: Tokyo Big Sight, East Hall 3, E21-2 Official Website: https://www.nepconjapan.jp/tokyo/ja-jp.html

• Composite Materials

We will be exhibiting at "Mechatrotech (or Monozukuri World)" held at Port Messe Nagoya (Nagoya International Exhibition Hall). During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 - Pferd - DC Swiss - Ensitec - Erichsen (Sheet metal) - EPK (if space allows) - Pipetite (if space allows)

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at the "14th Fukushima Renewable Energy Industry Fair (REIF Fukushima 2025)" held at Big Palette Fukushima from Thursday, October 16, 2025, to Friday, October 17, 2025. Focusing on energy visualization solutions that can be started "immediately," we will introduce power monitoring solutions for each equipment and load through examples of the overall system configuration. 【Main Exhibited Products】 - Gateway BOX We will showcase the "Gateway BOX," a product that packages the necessary equipment for easy adoption of the visualization system. - PAL-Plus type E2 (Scheduled for release soon) We will introduce a "smart" clamp CT that can easily measure power for three-phase three-wire and single-phase three-wire systems (scheduled for release soon). - CEW-M4 / PAL-Plus As a monitoring system that can display power consumption and remaining power capacity, we will present the manager software "CEW-M4," which supports up to 20,000 points, and the Modbus-compatible AC current sensor "PAL-Plus." We sincerely look forward to your visit.

Toyo Machinery Co., Ltd. will be exhibiting at the high-performance film exhibition held at Makuhari Messe. The High-Performance Film Exhibition - FILMTECH JAPAN - is a specialized exhibition where molding processing technologies, materials, and functional films themselves are showcased all in one place. Experts from various fields, including the technology departments of film manufacturers, electronics, automotive, batteries, construction and building materials, and food and beverages, will attend in search of functional films. At Toyo Machinery, we will display actual machines for waviness correction and wrinkle removal while running film, allowing you to see their effects and functions. We will also introduce the quality management system (weight, thickness, moisture, etc.) from the German company Marlo. ↓↓↓Toyo Machinery's exhibitor information↓↓↓ https://www.material-expo.jp/tokyo/ja-jp/search/2025/directory/details.org-a11cd7f5-2a7b-4ea7-85ce-cde885acd2dd.html#/ *If you wish to attend, you can pre-register via the "Details & Application" link below. We sincerely look forward to your visit.

We will be exhibiting at the Okayama Technology Exhibition (OTEX) 2025, which will be held at Convex Okayama from November 12 (Wednesday) to November 13 (Thursday), 2025. We will showcase our eco-board pallets (paper pallets) as well as comprehensive packaging solutions suitable for one-way shipments such as exports. Our products will assist in addressing challenges related to environmental considerations in the context of the SDGs and the promotion of white logistics. ■ Our booth: 46 (Company products) We sincerely look forward to your visit, and we hope you can come together.